innovation for industry
Join us on October 12th, 2018 in Munich to discover Leti IC design offer for foundries, design firms, fabless manufacturers and system providers. Discuss with Leti teams to get more information on IC design techniques leveraging FDSOI characteristics for digital, RF and analog integrated circuit design.
Leti is a proud sponsor of the event.
Munich Bayerpost, MunichWebsite: https://www.eiseverywhere.com/ehome/351190Contact: firstname.lastname@example.org
IRT Nanoelec webinar
During this webinar, after a glimpse of future prospects, Nanoelec speakers from CEA-Leti will share their latest results & performance obtained in integrated photonics technology: 300mm R&D and industrial fab, ultra-low loss waveguide, multi wavelength layer engineering with several waveguide materials (Si, Si3N4, SiGe, …), III-V material engineering and laser source integration, advanced electronic design automation tools and wafer-level testing.
Minatec, Grenoble, France
Parvis des sciences, Grenoble, France
For the twelfth consecutive year, the GIANT campus and its partners in Grenoble are mobilizing and organizing the 2019 Science Fair: Saturday, October 12 for the general public free entry and from October 10 to 11 for schoolchildren in Minatec, Parvis Louis Néel in Grenoble.
3 parvis Louis Néel 38054 Grenoble cedex 9 - MINATEC - Grenoble, France.
Are you ready to Embrace the World ?
Ever-increasing demands and expectations for semiconductor technology are matched only by the opportunities they present throughout the supply chain – and for end users. Next summer, CEA-Leti will offer a preview of what is in store for the next tech generation that will drive our future.
Explore coming innovations in semiconductors that will enable smart sensing, local processing, haptics, advanced imaging, smart power management, and new communication technologies.
WTC - Congress center 5-7, place Robert Schuman - Grenoble, France.
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.