innovation for industry
From 9/3/2019 to 9/3/2019
Palazzo di Toppo Wassermann, Università degli Studi di Udine, Udine, Italy.
Leti is pleased to offer a workshop on "Advanced Simulations for Emerging Non-Volatile Memory Technologies" during the 2019 IEEE SISPAD conference. FREE REGISTRATION.
As an official satellite event of the IEEE SISPAD conference, the workshop will held on Tuesday, September 3rd, from 5:00 pm to 7:30 pm, Palazzo di Toppo Wassermann, Università degli Studi di Udine, Udine, Italy.
Welcome and Introduction – T. Poiroux, Head of Simulation and Compact Model Laboratory, CEA-Leti
Innovative non-volatile memory technologies: a revolution for the storage towards a memory that thinks – G. Navarro, Non-Volatile Memory R&D Engineer, CEA-Leti
Electro-thermal and material simulations for PCM – O. Cueto, Simulation Engineer, CEA-Leti
Multiphase field method for the simulation of the complex phase changes in PCM – R. Bayle, PhD Student, ST Microelectronics
Invited talk: Self-consistent TCAD simulation of chemical reactions within electronic devices. Application to CBRAM and OxRAM – Philippe Blaise, Silvaco
To register, please send an email to firstname.lastname@example.org
San Francisco Marriott Marquis, CA, USA
The International Solid-State Circuits Conference (ISSCC) is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip
Alpexpo: 2 Avenue d'Innsbruck, 38100 Grenoble
The 23rd edition of the DATE international conference will take place at Alpexpo – Grenoble (France), from March 9 to 13, 2020. It is the largest European gathering in the fields of microelectronic design and embedded systems.
The CEA will notably be present through its two institutes List and Leti, on booths 7&8 .
San Diego Convention Center, San Diego, California, USA.
The Optical Fiber Communication Conference and Exhibition (OFC) is the largest global conference and exhibition for optical communications and networking professionals.
Pioneering Silicon photonics and III-V on Si lasers for more than 15 years, Leti has designed a technology toolbox featuring state-of-the-art performance to support the development of your innovative Photonic Integrated Circuit for high-speed optical communications, LIDAR, quantum and neuromorphic applications. Access to Leti's 200 or 300 mm platforms is given through Multi Project Wafer and dedicated runs.
WTC - Congress center 5-7, place Robert Schuman - Grenoble, France.
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on May 27-28, 2020
MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
Maison MINATEC 3 parvis Louis Néel, 38054 Grenoble
The 10th edition of the JNRSE – « National Days on Energy Harvesting and Storage » will take place on 27-28 May 2020 in Grenoble, France, organized by CEA-Leti and TIMA.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.