innovation for industry
From 10/16/2018 to 10/16/2018
San Francisco, USA
Leti, IRT NanoElec and Qualcomm are pleased to invite you to the 3DVLSI open workshop dedicated to High Density 3D-IC and CoolCubeTM (Monolithic/Sequential 3D) technologies. The event is organized as a satellite event of the IEEE 2018 S3S conference and will take place on Tuesday, Oct 16, 2018.
The 3DVLSI open workshop project's goals include building a complete ecosystem that takes the technology from design to fabrication.
A first 3DVLSI open workshop was organized in San Diego back in 2014. Since then, we have seen presentations from Applied Materials, ARM, Atrenta, Cadence, CEA-Leti, GeorgiaTech, Globalfoundries, HPE, Intel, Mentor Graphics, Monolithic3D, Qualcomm, Stanford University, TSMC and many more…
Now, the workshop has become a forum for industrial partners and ecosystem to share research & development progress in making innovative High Density 3D technologies a truly feasible path towards 3DVLSI industrialization for reliable and cost effective products.
3D technologies and applicationsSeverine
Cheramy, CEA-Leti, 3D Business development
3DVLSI CoolCube™ MPW & design roadmapSébastien Thuriès, CEA-Leti, Head of Digital Design
RETINE: A 3D application for parallel Imaging Fabien Clermidy, CEA-Leti, Head of Digital Design
Title to be definedKambiz
Sequential 3D Technology: from more Moore applications to technology diversificationAnne Vandooren, IMEC
Trends in 2.5D/3D High Density Advanced Package Verification Zain Ali, Mentor, A Siemens Business
Low thermal budget technologies for 3D-VLSIPapo Chen, APPLIED MATERIALS
Die-to-Wafer equipment for direct hybrid bonding in productionPascal
Metzger, SET Smart Equipment Technology
Alpexpo: 2 Avenue d'Innsbruck, 38100 Grenoble
The 23rd edition of the DATE international conference will take place at Alpexpo – Grenoble (France), from March 9 to 13, 2020. It is the largest European gathering in the fields of microelectronic design and embedded systems.
The CEA will notably be present through its two institutes List and Leti, on booths 7&8 .
San Diego Convention Center, San Diego, California, USA.
The Optical Fiber Communication Conference and Exhibition (OFC) is the largest global conference and exhibition for optical communications and networking professionals.
Pioneering Silicon photonics and III-V on Si lasers for more than 15 years, Leti has designed a technology toolbox featuring state-of-the-art performance to support the development of your innovative Photonic Integrated Circuit for high-speed optical communications, LIDAR, quantum and neuromorphic applications. Access to Leti's 200 or 300 mm platforms is given through Multi Project Wafer and dedicated runs.
Minatec, 3 Parvis Louis Néel, 38000 Grenoble
The MIT Global Startup Workshop (MIT GSW) will take place on March 23-24, 2020 at the Maison MINATEC in Grenoble, France and features nearly 400 entrepreneurs, intrapreneurs, students, academics, company leaders, managers and investors from around the world
WTC - Congress center 5-7, place Robert Schuman - Grenoble, France.
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on May 27-28, 2020
MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
Maison MINATEC 3 parvis Louis Néel, 38054 Grenoble
The 10th edition of the JNRSE – « National Days on Energy Harvesting and Storage » will take place on 27-28 May 2020 in Grenoble, France, organized by CEA-Leti and TIMA.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.