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Leti, IRT NanoElec and Qualcomm are pleased to invite you to the 3DVLSI open workshop dedicated to High Density 3D-IC and CoolCubeTM (Monolithic/Sequential 3D) technologies. The event is organized as a satellite event of the IEEE 2018 S3S conference and will take place on Tuesday, Oct 16, 2018.
The 3DVLSI open workshop project's goals include building a complete ecosystem that takes the technology from design to fabrication.
A first 3DVLSI open workshop was organized in San Diego back in 2014. Since then, we have seen presentations from Applied Materials, ARM, Atrenta, Cadence, CEA-Leti, GeorgiaTech, Globalfoundries, HPE, Intel, Mentor Graphics, Monolithic3D, Qualcomm, Stanford University, TSMC and many more…
Now, the workshop has become a forum for industrial partners and ecosystem to share research & development progress in making innovative High Density 3D technologies a truly feasible path towards 3DVLSI industrialization for reliable and cost effective products.
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8:00am
| 3D technologies and applications
Severine
Cheramy, CEA-Leti, 3D Business development
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8:25am
| 3DVLSI CoolCube™ MPW & design roadmap
Sébastien Thuriès, CEA-Leti, Head of Digital Design
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8:50am | RETINE: A 3D application for parallel Imaging
Fabien Clermidy, CEA-Leti, Head of Digital Design
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9:15am
| Title to be defined
Kambiz
Samadi, QUALCOMM
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9:40am
| Recent Advancement of RTL-to-GDS Toolset for Monolithic 3D ICs
Sung Kyu Lim, Georgia Tech University
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10:05am
| Break
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10:45am
| Sequential 3D Technology: from more Moore applications to technology diversification
Anne Vandooren, IMEC
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11:10am
| Trends in 2.5D/3D High Density Advanced Package Verification
Zain Ali, Mentor, A Siemens Business
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11:35am
| Low thermal budget technologies for 3D-VLSI
Papo Chen, APPLIED MATERIALS
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12:00pm
| Die-to-Wafer equipment for direct hybrid bonding in production
Pascal
Metzger, SET Smart Equipment Technology
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12:25pm
| Lunch
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Due to limited seats, please register by sending an email to
severine.cheramy@cea.fr
Website: http://s3sconference.org/satellite-events/
Contact: severine.cheramy@cea.fr