innovation for industry
Workshop in the frame of the 3DAM European ECSEL Project
CL & TEM Correlation on ingaas samples (8017Ko)
Registration & Information via YURPLAN, registration deadline March 8th Program: Click here
As nano-electronics, technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges which cannot be met by pushing the present techniques to their limits. 3DAM "3D Advanced Metrology and materials for advanced devices" is an EU-funded pathfinding and assessment project focusing on innovations and progress in metrology and characterization related to the latest generation of 3D front-end of line (FEOL) and back-end of line (BEOL) structures (fins, nanowires, TSVs) as well as 2D materials :
• Dimensional metrology: 3D-SPM, CD-SEM, OCD• Structural analysis: Electron Tomography, PL & CL, SHG, GHz-SAM, X-ray NanoCT• Compositional/dopant analysis: SIMS, APT, STEM-EDX and EELS, IRR, Raman, HRXRD• Carrier distribution and mobility: 3D-SSRM, micro-multi-point probes, THz spectroscopy• Strain and stress: HRXRD, Raman, Precession Electron Diffraction in a TEM
The goal of this workshop is to disseminate the results of the projects to the public. The combination with the insights and learnings from experts will make this one-day workshop an up-to-date overview of the most recent advances in the analytical techniques and diagnostic capabilities essential for technology development.
Keynote Speakers:Dr. Maud Vinet (LETI)Prof. Dr. Ehrenfried Zschech (Fraunhofer Institute)Invited Speakers:Dr. Delphine Le Cunff (ST Microelectronics)Dr. Zineb Saghi (LETI)Dr. Igor Turovets (NOVA)
Committee Co-Chairs:Dr. Vincent Delaye (LETI)Dr. Laurens Kwakman (Thermo Fisher Scientific)
Registration & Information via YURPLAN , registration deadline March 8th
WTC World Trade Center, Grenoble, France
Sensors and Imaging technologies are now everywhere!
Join both Semi European Imaging & Sensor Summits to be held on Sept. 25-27, 2019 in Grenoble, France to discover the latest available R&D and applications.
Guests will enjoy a series of keynotes on various hot topics, from automotive to healthcare/medical or industrial applications involving development and integration of MEMS and sensor technologies for autonomous systems for transportation and agriculture, cellular security systems, mixed reality (MR) headsets and biomedical wearables.
Parvis des sciences, Grenoble, France
For the twelfth consecutive year, the GIANT campus and its partners in Grenoble are mobilizing and organizing the 2019 Science Fair: Saturday, October 12 for the general public free entry and from October 10 to 11 for schoolchildren in Minatec, Parvis Louis Néel in Grenoble.
Espace Champerret, Paris, France
Looking for an R&D partner to get started on your innovation project or bring your project to maturity?
RENDEZ-VOUS CARNOT 2019 is made for you! This event brings together 38 French research institutes dedicated to large, medium and small enterprises. Join Leti Booth and learn more about the institute R&D offer for industry.
Keio Plaza Hotel, Tokyo, JAPAN & Hsinchu Science Park, Hsinchu, TAIWAN.
Cea-Leti organizes the Leti Days Asia from October, 16th to 18th at Taiwan and Tokyo.
Meet Leti and his partner VNano at CPhI and discover ou partnership on Lipidots® technology, versatile and biocompatible lipid-based delivery system nanoparticles for bio-medical applications.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.