Structural Electronics Platform
Smart surfaces
The Structural Electronics Platform is home to a wide range of resources for the integration of electronics directly onto flat and 3D surfaces. Electronics can be integrated onto rigid, flexible, and stretchable substrates measuring up to 320 x 380 mm² using either printing or vacuum deposition. Thermoforming is used to obtain 3D substrates. The platform also has pick and place (PNP) machines to assemble components. For plastronics-type projects, these processes can be used with plastic injection overmolding. The platform, unlike any other facility in Europe, is home to a wide range of process equipment and activities, helping drive innovation in human-machine interfaces, medical devices, interactive displays, and more.
All sheet-to-sheet printing processes, whether manually or automatically fed, are conveniently located together. These include screen printing, inkjet printing, rotogravure, flexography, and slot-die printing. The platform also has the necessary assembly and encapsulation machines.
A full range of electrical, optical, and mechanical characterization tools for sensors and actuators
Tools to test the reliability of components like sensors and actuators
Tools to develop control electronics for sensors and actuators
The possibility of making PoC and other prototypes, and manufacturing pilot prototypes