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The CEA announces expanded collaboration with Intel to advance cutting-edge research and innovation in key digital areas

​The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a new R & D agreement signed in Paris on Thursday 12 May. This collaboration, extended to several key areas in digital technology, will enable the two sides to develop a shared R&D programme and jointly submit research and innovation projects on a European scale, particularly as regards High Performance Computing (HPC), as part of the Horizon 2020 programme.

Published on 12 May 2016

​The new CEA-Intel agreement involves several strategic research programmes with the teams of the CEA's Leti Institute in Grenoble, including the Internet of Things, high-speed wireless communication, security technologies and 3D displays.. It also means that the two companies will work together to jointly submit projects to Europe's biggest innovation and research programme, Horizon 2020.


This agreement, concluded for a minimum of five years, concerns the current development of digital technologies and the Internet of Things (IoT), including: 

  • The development of new materials in order to further the miniaturisation and adaptability of electronic components used in mobile phones. The nature of these components and their layout are crucially important to the system's performance, size and cost. 
  • The development of wireless communication systems and faster exchanges,
  • The integration of connected objects and the study of low-consumption communication technologies.

After the signature of the agreement in Paris, the director of the CEA's Leti Institute, Marie-Noelle Semeria, said, "The CEA and Intel have a long history of shared technological development in high-performance computing. This collaboration marks the recognition of the CEA-Leti as one of Europe's most innovative players in the IoT and the basic technologies of Cloud computing and Big Data. It also increases the attractiveness of the Grenoble Valley in terms of microelectronics."

According to vice president of the Data Center Group and general manager of the Enterprise and HPC Platform Group Raj Hazra, said, "This announcement expands upon our long standing high performance computing relationship with CEA to drive leading edge innovation in IoT, wireless, and security in the European community.  We look forward to the important innovations and discoveries to come from this collaboration."

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