handling of glass and ceramic ultrathin substrates for flexible thin film batteries
| Description | |
| Date | 2018 |
| Date | |
| Auteurs | Bedjaoui,- M | Amiran,- J | Poulet,- S | Lopez,- N | Rouchou,- J | |
| Source | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 (pp 238-242) |
| Résumé | This paper reports a novel handling technique based on the use of structurally stuffed-Thin sheet as a substrate for flexible and high temperature-fabricated devices. In the presented method, the ultrathin substrate is bonded to an adapted frame using adhesive material compatible with high temperature budgets (>600°C). This concept is evaluated through the realization of solid ultrathin-film batteries TFB ( |
| DOI | http://dx.doi.org/10.23919/ICEP.2018.8374711 |
| Type de documents | |
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