selective nickel platinum removal without titanium nitride metal gate corrosion
| Description | |
| Date | 2021 |
| Date | |
| Auteurs | Garnier,- P | Audouin,- M | Pizzetti,- C | Loup,- V | Gabette,- L | Morote,- C | Dekraker,- D | Schwab,- B | |
| Source | |
| Résumé | During silicide formation, unreacted NiPt metals is traditionally removed either by aqua regia (ESH concern) or SPM. This latter can easily degrade the device yield in HKMG (High K Metal Gate) nodes if the metal gates (usually TiN based) aren’t perfectly encapsulated. First some new characterizations are presented to better understand the NiPt metal alloy removal, then a new solution is given to be able to remove this alloy without degrading HKMG materials. © 2021 Trans Tech Publications Ltd, Switzerland. |
| DOI | 10.4028/www.scientific.net/SSP.314.289 |
| Type de documents | |
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