cleaning surfaces from nanoparticles with polymer film: impact of the polymer stripping
| Description | |
| Date | 2018 |
| Date | |
| Auteurs | Lallart,- A | Garnier,- P | Lorenceau,- E | Cartellier,- A | Charlaix,- E | |
| Source | Micro and Nano Engineering Volume 1 (pp 33-36) |
| Résumé | The removal of nanometric particles constitutes one of the main challenges for the Integrated Circuits manufacturing. A solution based on the polymer coating and removal without substrate consumption is described and its performances are evaluated. In our experiments, 60 nm SiO 2 particles and 40–200 nm Si 3 N 4 particles are used to contaminate Si wafers. Two polymer removal methods are compared, one is purely based on a chemical action while in the other one a chemical and a physical actions are coupled. We demonstrate that a physical action is required to remove particles. The process shows high Particle Removal Efficiency (PRE) up to 87% independently of the particle size and nature. The PRE stays at a constant value, around 85%, for 3 decades of aging time, but the particle removal is not uniform on all the wafer. © 2018 The Authors |
| DOI | http://dx.doi.org/10.1016/j.mne.2018.09.001 |
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