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Thin hybrid pixel assembly fabrication development with backside compensation layer

Publié le 29 mars 2018
Thin hybrid pixel assembly fabrication development with backside compensation layer
Auteurs
Bates R., Buttar C., McMullen T., Cunningham L., Ashby J., Doherty F., Pares G., Vignoud L., Kholti B., Vahanen S.
Year2017-0158
Source-TitleNuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Affiliations
Experimental Particle Physics Group, SUPA School of Physics and Astronomy, The University of Glasgow, Glasgow, United Kingdom, CEA Leti, MINATEC, 17 rue des Martyrs, GRENOBLE, France, Advacam Oy, Tietotie 3, Espoo, Finland
Abstract
The ATLAS and CMS experiments will both replace their entire tracking systems for operation at the HL-LHC in 2026. This will include a significantly larger pixel systems, for example, for ATLAS approximately 15 m2. To keep the tracker material budget low it is crucial to minimize the mass of the pixel modules via thinning both the sensor and readout chip to about 150 ?m each. The bump yield of thin module assemblies using solder based bump bonding can be problematic due to wafer bowing during solder reflow at high temperature. A new bump-bonding process using backside compensation on the readout chip to address the issue of low yield will be presented. The objective is to compensate dynamically the stress of the front side stack by adding a compensating layer to the backside of the wafer. A SiN and Al:Si stack has been chosen for the backside layer. The bow reducing effect of applying a backside compensation layer will be demonstrated using the FE-I4 wafer. The world's first results from assemblies produced from readout wafers thinned to 100 ?m with a stress compensation layer are presented with bond yields close to 100% measured using the FE-I4 readout chip. © 2016
Author-Keywords
Pixel assembly, Pixel detector, Silicon sensor, Thin readout chip
Index-Keywords
Budget control, Flip chip devices, Pixels, Readout systems, Silicon nitride, Silicon sensors, Silicon wafers, Soldering, Bump bonding process, High temperature, Module assemblies, Pixel detector, Readout chips, Reducing effects, Stress compensation, Tracking system, Wafer bonding
ISSN1689002
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