ITAC: A complete 3D integration test platform
| Auteurs | Lattard D., Arnaud L., Garnier A., Bresson N., Bana F., Segaud R., Jouve A., Jacquinot H., Moreau S., Azizi-Mourier K., Chantre C., Vivet P., Pillonnet G., Casset F., Ponthenier F., Farcy A., Lhostis S., Michailos J., Arriordaz A., Cheramy S. |
| Year | 2017-0337 |
| Source-Title | 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 |
| Affiliations | CEA, LETI, MINATEC Campus, 17 rue des Martyrs, Grenoble, France, STMicroelectronics, 850 rue Jean Monnet, Crolles, France, Mentor Graphics, Inovallée Montbonnot, St Ismier, France |
| Abstract | System integration takes benefit from 3D stacking technology in a wide range of applications such as smart imagers, photonic, wide I/O memories and high-performance computing. The 700 mm2 ITAC 3D integration test platform contains a set of 'Integrated Technological and Application Circuits' for process development, electrical and RF characterization, reliability, die stacking, warpage and underfilling studies, DC-DC converter and IntAct chip which is the full application chip. After a brief presentation of the targeted high performance computing application. The contributions integrated in the test platform are described with a particular focus on the 10 ?m diameter 20 ?m pitch die-to-die interconnects which is the key technology of the 3D stack. These test vehicles have been embedded on the same silicon to secure the application chip at all the steps from technology development to assembly and test. © 2016 IEEE. |
| Author-Keywords | 3D stacking, Cu-pillar, test platform |
| Index-Keywords | DC-DC converters, 3D stacking, 3D stacking technology, Application circuits, Cu pillar, High performance computing, High-performance computing applications, Technology development, Test platforms, Three dimensional integrated circuits |
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