Vous êtes ici : Accueil > Heat spreading packaging solutions for hybrid bonded 3D-ICs


Heat spreading packaging solutions for hybrid bonded 3D-ICs

Publié le 29 mars 2018
Heat spreading packaging solutions for hybrid bonded 3D-ICs
Prieto R., Coudrain P., Colonna J.P., Hallez Y., Chancel C., Rat V., Dumas S., Romano G., Franiatte R., Brunet-Manquiat C., Cheramy S., Farcy A.
Source-Title2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
STMicroelectronics, 850 rue Jean Monnet, Crolles Cedex, France, Univ. Grenoble Alpes, Grenoble, France, Univ. Grenoble Alpes, G2Elab, Grenoble, France, CEA, LETI, MINATEC Campus, Grenoble, France
Direct hybrid bonding is considered as one of the most promising technologies for high performance 3D-ICs. Its face-to-face structure allows significant inter-connexion capabilities. Nonetheless, it also implies increased thermal densities that will be reflected in both die tiers due to the lack of insulating barriers. This work investigates the thermal interactions between two hybrid bonded dice for different case scenarios. A specific test vehicle comprising heaters and temperature sensors have been designed. Packaging variables such as silicon thickness, substrate thermal design or TIM conductivity and thickness are studied. © 2016 IEEE.
heat management, hot spot, hybrid-bonding, thermal packaging
Timing circuits, Heat management, Hot spot, Hybrid bonding, Insulating barriers, Packaging solutions, Silicon thickness, Specific test vehicle, Thermal interaction, Three dimensional integrated circuits
Lien vers articleLink

Retour à la liste