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Low temperature direct bonding comparison

Publié le 29 mars 2018
Low temperature direct bonding comparison
Auteurs
Fournel F., Larrey V., Morales C., Bridoux C., Moriceau H., Rieutord F.
Year2017-0281
Source-TitleProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
Affiliations
Univ. Grenoble Alpes, Grenoble, France, CEA, LETI, MINATEC, Grenoble, France
Abstract
Low temperature direct bonding technologies are now widely used for many applications. Mechanisms of some of these technics will be presented. The different way to obtain low temperature direct bonding will then be compared with their respective advantages and drawbacks. © 2017 JSPS 191st Committee on Innovative Interface Bonding Technology.
Author-Keywords
 
Index-Keywords
Low temperature operations, Temperature, Three dimensional integrated circuits, Low temperature direct bonding, Bonding
ISSN 
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