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Polymer bonding temperature impact on bonded stack morphology and adherence energy

Publié le 1 octobre 2018
Polymer bonding temperature impact on bonded stack morphology and adherence energy
Auteurs
Montméat P., Enot T., Louro De Oliveira G., Fournel F.
Year2018-0016
Source-TitleMicrosystem Technologies
Affiliations
Univ. Grenoble Alpes, Grenoble, France, CEA, Leti, Minatec Campus, Grenoble, France
Abstract
This paper deals with the effect of the silicon bonding temperature with thermoplastic adhesive. The bonding temperature exhibits a significant effect on the morphology and on the adherence energy of the bonded stack. A suitable temperature control leads to an excellent homogeneity of the bonded structure and an optimal total thickness variation (TTV) value. Using Brewer Bsi5150 adhesive material, 275 °C appears as the optimal bonding temperature in order to optimize the TTV from 55 µm down to 5 µm. The adherence of the structure is also increased with high bonding temperatures. Indeed, the adherence energy is above 10 J/m2 when the temperature is above 250 °C. On the contrary, when the temperature is less than 150 °C, the adherence is only around 1 J/m2. Noteworthy, this value is suitable for back side processing and a mechanical debonding of the structure without any need of other specific layer which could lead to a very simple temporary bonding process. © 2017, Springer-Verlag GmbH Germany.
Author-Keywords
 
Index-Keywords
Bonding, Structural optimization, Adhesive materials, Bonded structure, Bonding temperatures, Polymer bonding, Silicon bonding, Temporary bondings, Thermoplastic adhesive, Total thickness variations, Debonding
ISSN9467076
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