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Exploration of the mechanical stress can be incorporated after the fabrication of semiconductor devices

Publié le 7 décembre 2023
Exploration of the mechanical stress can be incorporated after the fabrication of semiconductor devices
Référence3386350
Domaine scientifiqueMatériaux
SpécialitéMatériaux
Moyens
Semiconductor process technology, Raman spectroscopy, X-ray diffraction, finite element method
Compétences Informatiques
-
Mots clésMaterials
Durée du stage6 months
LieuGrenoble
LocalisationRégion Rhône-Alpes (38)
FormationIngénieur/Master
Niveau d'étudeBac + 4/5
Thèse possible0
Date de diffusion 
Description du stage
" Mechanical stress is used to vary the properties of semiconductors (charge carrier mobility, piezoelectric coefficients, energy band structure...). Since the early 2000s, this parameter is used to actively maximize the performance of digital CMOS technologies, starting from Intel 90nm technology up to today's 22FDX technology, in the development of which Leti has been involved and that GlobalFoundries has put into production in Dresden. Mechanical stress modulation is also one of the key ingredients in the race to develop a germanium laser, which, among others, involves MIT, Stanford University, Paris Sud University and Leti. Most current approaches to stress incorporation use a specific substrate or dedicated processes during device fabrication. The proposed route this internship will explore fits beyond device fabrication, at the time of packaging. The study will determine the potential of this approach for at least one of Leti activity domains: microelectronics, optoelectronics, power electronics. In practice, simplified demonstrators will be fabricated in the Leti pilot line. They will be characterized by Raman spectroscopy and X-ray diffraction measurements. These measurements will feed into the calibration of a finite element model. This will allow to evaluate the potential of the approach and determine the most favorable configurations to be implemented. About Leti: Leti is an institute of CEA, a French research-and-technology organization with activities in energy, IT, healthcare, defence and security. Leti is focused on creating value and innovation through technology transfer to its industrial partners. It specializes in nanotechnologies and their applications, from wireless devices and systems, to biology, healthcare and photonics. NEMS and MEMS are at the core of its activities. In addition to Leti’s 1,700 employees, there are more than 250 students involved in research activities, which makes Leti a mainspring of innovation expertise. Leti’s portfolio of 2,800 patents helps strengthen the competitiveness of its industrial partners. (http://www.leti.fr/en)"
Email tuteuremmanuel.augendre@cea.fr

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