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250th ECS Meeting

Du 25/10/2026 au 29/10/2026
Calgary, Canada

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Discover CEA-Leti’s latest results in electronic materials and processing, electronic and photonic devices and systems, dielectric science and materials, and electrochemical / electroless deposition.​

CEA-Leti will participate in the 250th ECS Meeting in Calgary with 20 scientific contributions and 6 session Chairs, highlighting major research results in electronic materials and processing, electronic and photonic devices and systems, dielectric science and materials, and electrochemical/electroless deposition. ​


DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS AT 250TH ECS MEETING

With 20 papers (18 as first author), the institute will present this year’s major scientific results at ECS, including the following topics:

  • Electronic Materials and Processing
  • Electronic and Photonic Devices and Systems
  • Dielectric Science and Materials
  • Electrochemical/Electroless Deposition

Symposium G04 - SiGe, Ge, and Related Compounds

Sunday, 25 October 2026
08:10 am - 08:40 am
Room 236
(Level 2, BMO Centre)

C. Cardoux,
P. Goulain,
L. Bonin,
G. Persenda,
L. Casiez,
J. Chretien,
J. M. Hartmann,
N. Coudurier,
P. Rodriguez,
A. Vandeneynde

Monolithic Electrically Pumped Group-IV Lasers on ​Silicon: Unlocking High-Temperature Operation through Current Injection

Monday, 26 October 2026
10:20 am - 10:40 am
Room 212
(Level 2, BMO Centre)​

G. Strobbia,
J. Mayolet,
A. Raison,
J. Kanyandekwe,
N. Gauthier,
B. Mohamad,
C. Guerin,
T. Mota Frutuoso,
V. Jousseaume

A Study on Annealing-Induced Passivation of Trap States In a Low-k Spacer

Symposium E02 - Electrodeposition Processes

Monday, 26 October 2026
01:40 pm - 02:10 pm
Room 235
(Level 2, BMO Centre)

C. Lobre,
T. Le Goff,
T. Journot,
N. Baier (Univ. Grenoble Alpes, CEA, Leti),
L. Rubaldo (Lynred),
S. Bel,
A. Colas--Reuillon,
E. Serres,
F. Rochette,
F. Marmonier,
C. Grezes,
C. Cassillo,
O. Gravrand

Redesigned MCT-Based p-on-n Process for Enhanced Stability in Infrared Focal-Plane Arrays

Symposium G03 - Semiconductor Wafer Bonding

Tuesday, 27 October 2026
09:30 am - 09:50 am
Percheron Ballroom B
(Level 3, BMO Centre)

V. Larrey,
N. Badey,
C. Morales,
P. Noël,
F. Fournel

A New Model for the Relation between Particle Size and Bonding Void Defect

Tuesday, 27 October 2026
11:10 am - 11:30 am
Room 212
(Level 2, BMO Centre)

A. Raison,
G. Strobbia,
C. Guerin,
M. Dartois,
T. Mota Frutuoso,
B. Mohamad,
N. Gauthier,
V. Thoréton,
H. Duchemin,
V. Jousseaume

Impact of Remote Hydrogen Plasmas in the Cyclic Radical-Assisted CVD of Silicon Oxycarbide Thin Films

Tuesday, 27 October 2026
03:00 pm - 03:20 pm
Percheron Ballroom B
(Level 3, BMO Centre)

B. Barbier,
V. Larrey,
Y. Bogumilowicz,
F. Fournel

Strengthening of the Bonded Interface at Very Low Temperatures (below 100°C)

Symposium G04 - SiGe, Ge, and Related Compounds

Wednesday, 28 October 2026
08:30 am - 08:50 am
Room 236
(Level 2, BMO Centre)

P. Tchoulfian,
D. Barge,
J. M. Hartmann,
S. Kerdilès,
V. Larrey,
F. Fournel,
V. Loup,
P. Hauchecorne,
A. M. Papon,
A. Thouvard,
J. Richy,
Y. Mazel,
N. Gauthier,
A. Fraczkiewicz,
G. Pares

Fabrication of a Si/SiGe Channel Stack Using Wafer-to-Wafer Bonding and BESOI Technique for CFET Applications

Symposium G03 - Semiconductor Wafer Bonding

Wednesday, 28 October 2026
09:30 am - 09:50 am
Percheron Ballroom B
(Level 3, BMO Centre)

F. Fournel,
P. Perreau,
G. Enyedi,
A. Berthelot

Eutectic Bonding for MEMS: Reliability and Squeeze out Control

Wednesday, 28 October 2026
10:30 am - 11:10 am
Percheron Ballroom B
(Level 3, BMO Centre)

P. Montméat,
M. Vacon,
F. Fournel,
T. Enot,
A. Thiolon,
L. Sanchez

Capillary Self-Assembly: Benefit for Direct Die-to-Wafer Bonding

Wednesday, 28 October 2026
02:40 pm - 03:00 pm
Percheron Ballroom B
(Level 3, BMO Centre)

H. Hijazi,
C. Morales,
F. Gay,
F. Fournel,
A. Cornelis,
R. Bouis,
J. Moeyaert,
P. Perreau

Impact of Cu Passivation on Cu-Cu Bonding Interface Reconstruction for Low-Temperature Hybrid Bonding

Wednesday, 28 October 2026
04:00 pm - 04:20 pm
Percheron Ballroom B
(Level 3, BMO Centre)

F. Fournel,
R. Guillemaud

Finite Element Modeling of Direct Wafer Bonding: A Calibrated 2D–3D Framework for Bonding Wave Propagation

Symposium G04 - SiGe, Ge, and Related Compounds

Wednesday, 28 October 2026
05:20 pm - 05:40 pm
Room 236
(Level 2, BMO Centre)

M. Bardet,
J. Lespiaux,
N. Gauthier,
E. Dos Reis,
C. Lecouvey,
V. Lapras,
F. Bringuier,
J. M. Hartmann

On the Use of N2 As a Carrier Gas for Low Temperature Sige:B Selective Epitaxial Growth during the Production of Advanced p-Type Fd-SOI Devices

Wednesday, 28 October 2026
05:40 pm - 06:00 pm
Room 236
(Level 2, BMO Centre)

J. Lespiaux,
M. Bardet,
J. M. Hartmann

A One-to-One Comparison of N2 Versus H2 as a Carrier Gas for SiGe:B Selective Epitaxial Growth

Wednesday, 28 October 2026
06:00 pm - 08:00 pm
Champions Ballroom A & B
(BMO Centre)

J. M. Hartmann,
F. Roze,
A. Romano,
C. Pichard

Impact of Temperature on the Epitaxial Growth of Si and SiGe with Disilane

Thursday, 29 October 2026
08:00 am - 08:20 am
Room 236
(Level 2, BMO Centre)

F. Gonzatti,
L. Saidi,
A. Romano,
S. Vialle,
J. M. Hartmann

Impact of Temperature, Pressure and Precursor Chemistry on Growth Kinetics and Boron Incorporation during Si:B Epitaxy

Thursday, 29 October 2026
08:20 am - 08:50 am
Room 236
(Level 2, BMO Centre)

J. Kanyandekwe,
B. Mohamad,
V. Lapras,
F. Bringuier,
Z. Chalupa,
T. Mota Frutuoso,
K. Romanjek,
J. Lacord,
T. Marion,
L. Saidi,
L. Laraignou,
P. Hauchecorne,
J. Lespiaux,
N. Gauthier,
T. Cabaret,
M. Dartois,
A. Raison,
M. Jourdan,
V. Loup,
A. Bond,
J. Richy,
A. Thouvard,
L. Couture,
A. Blot-Saby,
O. Glorieux,
A. Lassenberger,
N. Bernier,
G. Persson,
D. Cooper,
M. Dryhailo,
A. Grenier,
T. Dewolf,
T. Muller,
A. Andre,
J. Marchand,
T. Monniez,
S. Jarjayes,
A. S. Royet,
R. Chouk,
O. Cueto,
M. C. Cyrille,
C. Fenouillet-Beranger,
J. M. Hartmann

Selective Epitaxial Growth of Very Highly Doped Sip Raised Sources and Drains Yielding Low Ron and Significant idsat Gains in 10 Nm Fd-SOI nMOS Transistors

Thursday, 29 October 2026
11:10 am - 11:30 am
Percheron Ballroom C
(Level 3, BMO Centre)

G. AL Hoyek,
V. Lumineau,
V. Loup

Wet Chemical Passivation of InP(100) Surfaces Using O₃

Symposium G03 - Semiconductor Wafer Bonding

Thursday, 29 October 2026
11:10 am - 11:30 am
Percheron Ballroom B
(Level 3, BMO Centre)

E. Moulé,
C. Licitra,
F. Fournel

Hydrophilic Bonded InP-InP Interface Study at Low Annealing Temperature

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ABOUT THE 250TH ECS MEETING

Join us in Calgary, Canada, October 25–29, 2026, for the 250th ECS Meeting a historic celebration of science, innovation, and community. This milestone event brings together researchers, engineers, and leaders from around the world to exchange ideas, foster collaboration, and shape the future of electrochemical and solid-state science. Through world-class presentations, panels, poster sessions, and exhibits, the meeting celebrates ECS’s legacy while inspiring the next generation of clean-energy, sustainable-technology, and materials breakthroughs.​

DL_Icon.png More information on ​250th ​ECS Meeting’s website

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Infos Pratiques

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From 10/25 to 10/29/2026 | Calgary, Canada

Website​​​

 Contacts​ Jean-Michel HARTMANN with any questions.​​


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Jean-Michel HARTMANN

Research engineer

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