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Event | New technologies


Leti Devices Workshop 2022

From 12/4/2022 to 12/4/2022
Nikko Hotel, 222 Mason Street, San Francisco, CA 94 702

Highly efficient innovative technologies for More than Moore solutions

Applications for More than Moore require cutting-edge solutions that combine efficient processing and innovative sensing. From curing to sensing, transporting and communicating, numerous factors are driving the roadmap to improve a variety of applications. During the Leti Devices Workshop, CEA-Leti experts will share their visions, innovations and achievements in these fields. Notably, the event will highlight key results in terms of efficient computing (FD-SOI, chiplet, memories), radiofrequency devices and innovative co-integration with sensors.




Sébastien Dauvé
CEO, CEA-Leti
Colette Maloney
Head of Unit - Microelectronics & Photonics Industry, European Comission

Head of Silicon Component Division, CEA-Leti


Elisa Vianello
Embedded AI Program Director, CEA-Leti


Fabien Clermidy
Head of Digital Systems and Integrated Circuits Division, CEA-List


System to Technology Transverse Programs Manager, CEA-Leti


Research Engineer in Edge AI, CEA-Leti


VP Strategic Development, CEA-Leti

ancre_program

Workshop Program 



Welcome and workshop with:

  • Chairman
    Thomas Signamarcheix, VP Strategic Development, CEA-Leti

  • Welcome & Introduction
    Sébastien Dauvé, CEO, CEA-Leti

  • Title to be confirmed
    Colette Maloney, Head of Unit - Microelectronics & Photonics Industry, European Comission

  • Efficient neuromorphic computing using non-volatile memories
    Elisa Vianello, Embedded AI Program Director, CEA-Leti

  • Chiplet revolution: solutions for the rapidly changing semiconductor world
    Fabien ClermidyHead of Digital Systems and Integrated Circuits Division, CEA-List

  • FD-SOI: supporting the 6G RF roadmap
    Didier BelotSystem to Technology Transverse Programs Manager, CEA-Leti

  • Ultra Small-Edge AI to smarten sensors
    Emmanuel HardyResearch Engineer in Edge AI, CEA-Leti

  • The path towards scaled and efficient FD-SOI technology
    Olivier Faynot, Head of Silicon Component Division, CEA-Leti




Practical information

Workshop: 5:30 p.m. – 7:00 p.m.

Networking reception: 7:00 p.m. – 9:00 p.m.

Contact : letiinnovationdays@cea.fr  with any questions.

In-person event.


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