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Company will produce microLEDs on both 200mm and 300mm silicon wafers
We believe producing microLEDs on large-area 300mm silicon wafers is a world's first, and opens this technology to huge potential-volume-manufacturing capabilities, said Giorgio Anania, Aledia CEO and cofounder. The larger size allows 60-100 smartphone displays to be made on a single 300mm wafer, versus approximately four-to-six using the present LED industry-standard, 4" sapphire substrate. Thanks to Aledia's unique nanowire LED technology (3D LED), this can be done with commercially available processes and equipment, since it uses standard-thickness (780µm) silicon wafers.
We are very pleased to have helped Aledia push forward the state of the art of 3D LED manufacturing using our 300mm silicon processing line. We believe large-area silicon wafers are the best manufacturing platform in the world today for displays, and give big advantages in manufacturability, said
Emmanuel Sabonnadière, CEO of CEA-Leti. 3D nanowire micro-LEDs have the potential to make serious penetration into large display markets. CEA-Leti is very active today in supporting the display industry's transition to micro-LED technology.
We believe the use of large-area silicon wafers and microelectronics foundries are the only way to deliver the huge volumes demanded by end-user markets, Anania said. For example, if only the large-screen TVs of 60” in diagonal and larger transitioned to silicon nanowire technology to obtain better image quality and lower manufacturing costs, this would require 24 million 300mm wafers per year, volumes that can only be delivered by the silicon industry and supply chains. Smartphones, laptops and tablets would be on top of that
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Acteur majeur de la recherche, du développement et de l'innovation, le CEA intervient dans quatre grands domaines : énergies bas carbone, défense et sécurité, technologies pour l’information et technologies pour la santé.