PICTIC is a technological platform dedicated to flexible electronics and printed sensors. It is located at the CEA-Liten in Grenoble, a European institute dedicated to new energy technologies and materials.
The PICTIC platform develops, on sheet to sheet mode, smart plastics, papers, and textiles which are produced by combining printing electronics functions together with silicon based devices. The applications include the development of human-machine interfaces, actuators, sensors, TFT backplanes and driving circuits. This R&D facility is unique in Europe as it brings together, in a single area, high level expertise and a range of different printing and assembly machines. Moreover, the platform is surrounded with design, characterization and reliability research groups. The platform has expertise in scaling up printing processes for industrial partners and in prototyping electronic devices. It has track record of worldwide industrial collaborations with USA, Asia and European companies. CEA is member of the consortium of InSCOPE (grant agreement No 731671),Smartees (grant agreement No. 761496) H2020 project, and coordinator of PYCSEL H2020 project (grant agreement No 732423), which will participate to the OE-A 2019 competition (OE-A booth B0 216). PYCSEL H2020 demonstrator is a thin thermal fingerprint sensor enabled by TOLAE technology.
H2020 Pilot Lines (LYTEUS/INSCOPE, Coord. TNO) and Digital Innovation Hub (SmartEEs, Coord. CEA) are three combined Innovation Actions supporting the European industry in its digital transformation and promoting the uptake of Organic Large Area Electronics (OLAE) technologies. In particular, these collaborative projects aim at supporting SMEs in accelerating the digitisation of their products, services and business models thanks to:
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.