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SPIE Advenced Lithography + Patterning

Du 22/02/2026 au 26/02/2026
​Convention Center - San Jose, California, US

​​​​​​​​​​​​​​​​​​EVENT

Discover CEA-Leti’s latest technological in spie advanced lithography + patterning​

La conférence incontournable pour découvrir les dernières avancées en lithographie optique, EUVL, technologies de patterning, métrologie et intégration des procédés pour la fabricatio​​n de semi-conducteurs et les applications associées.​

DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS

With 11 papers,the institute will present this year’s major scientific results at SPIE Advanced Lithography + Patterning search. including the following topics :  

  • Thermal scanning probe lithography into the nanofabrication of semiconductor quantum devices
  • Evaluation of a non-fluorine (non-PFAS) ArF-immersion photoresist used in semi-conductor manufacturing
  • Variability aware DUV lithography process optimization for reliability-critical products
  • Modelling the full process from layout to post-etch imaging using a variational autoencoder
  • Advanced CDSEM and SEM distortion optimization on thick oxide devices
  • Characterization of the line edge roughness by small angle X-ray scattering
  • Exploration and mitigation of local wafer deformations resulting from direct wafer-to-wafer bonding
  • Cost-effective sub-wavelength structuring via block copolymer blend self-assembly for optical applications
  • The curvy road to silicon photonics manufacturing
  • Plasma etching process tailoring for different polysilicon microstructures used in 10 nm FDSOI metal gate stacks.
  • Sustainable plasma processes for the cleaning of etching reactors


CEA-Leti scientific papers

25 February 2026
05:30 PM - 07:00 PM​​
Hall 2
Paper 13982-50​​

Guido Rademaker

​​Introducing thermal scanning probe lithography into the nanofabrication of semiconductor quantum devices​

25 February 2026
​11:30 AM - 11:50 AM
Room 210C​​​
Paper 13983-45​

1st Author :Jérôme Rêche​
Authors : Jeanne Davost 
Jeanne Aigoin
Christophe Grangier
​Sebastien Guilbaud

Evaluation of a non-fluorine (non-PFAS) ArF-immersion photoresist used in semi-conductor manufacturing​

25 February 2026
​04:40 PM - 05:00 PM
Grand Ballroom 220A
Paper 13979-42

1st Author : Emilie Eustache
Authors : Nacenta Jorge
Jonathan Pradelles
Raluca Tiron

25 February 2026
09:30 AM - 09:50 AM
Room 210A
Paper 13981-11

1st Author : Annabelle Narsama
Authors : Elie Sezestre
Raluca Tiron

Modelling the full process from layout to post-etch imaging using a variational autoencoder

25 February 2026
05:30 PM - 07:00 PM
Hall 2​
Paper 13981-125

Tristan Dewolf
Tifaine Muller
Cyril Bellegarde 
Laurent Coindoz-Bernard

Advanced CDSEM and SEM distortion optimization on thick oxide devices

25 February 2026
08:50 AM - 09:10 AM
Room 210A
Paper 13981-32

1st Author : Nischal Dhungana​
Authors : Matteo Knebel
Tristan Dewolf​
Patrick Quéméré​
Patrice Gergaud​
Guillaume Freychet​

Characterization of the line edge roughness by small angle X-ray scattering

25 February 2026
05:10 PM - 05:30 PM
Room 211B​​​​
Paper 13982-42​

Authors : Ivanie Mendes
Marie-Line Pourteau
Michael May
​Karine Abadie​
​Hadi Hijazi
​Viorel Balan
​Frank Fournel
​Laurent Pain​

Exploration and mitigation of local wafer deformations resulting from direct wafer-to-wafer bonding

25 February 2026
Heure​ ?
Hall 2​
Paper 13982-71

1st Author : Raphaël Feougier
Author : Noah Lamure

Cost-effective sub-wavelength structuring via block copolymer blend self-assembly for optical applications​

25 February 2026
10:50 AM - 11:10 AM
Grand Ballroom 220B
Paper 13980-15

Authors : Ujwol Palanchoke
Guillaume Chataignier
​Vincent Berg
Cyril Bellegarde​​

The curvy road to silicon photonics manufacturing

​24 February 2026
09:10 AM - 09:30 AM
Grand Ballroom 220C
Paper 13984-3

1st Author : Mouaad Yassine Aliouat
Authors : Jérôme Dubois
Patricia Pimenta-Barros
Aurélien Sarrazin
Sylvain Beaurepaire
​Olivier Dubreuil
​Ludovic Couture
Laurent Brevard
Alexandre Magalhaes-Lucas
Claire Fenouillet-Beranger
François Boulard

Plasma etching process tailoring for different polysilicon microstructures used in 10 nm FDSOI metal gate stacks

26 February 2026
09:00 AM - 09:20 AM
Grand Ballroom 220C​​​
Paper 13984-32

1st Author : Nina Bernard
Authors : Christelle Boixaderas
Aurélien Sarrazin
Thierry Chevolleau
François Boulard

Sustainable plasma processes for the cleaning of etching reactors​



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SPIE Advenced Lithography + Patterning

La conférence incontournable pour découvrir les dernières avancées en lithographie optique, EUVL, technologies de patterning, métrologie et intégration des procédés pour la fabrication de semi-conducteu​​rs et les applications associées.​

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Laurent PAIN

Sustainable Electronics Program Director

Nacima ALLOUTI

Industrial Partnerships
Manager for Silicon Technologies division,
CEA-Leti​​

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