innovation for industry
Article | High performance computing
Taking up tomorrow's computing challenges in a connected world: maintaining performance progress while curtailing power consumption.
New computing technologies
The demo enables massively parallel, low-power and low-latency computation abd will be demonstrated at Flash Memory Summit 2019, August 6-8.
CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM. Target applications include energy-efficient, smart-sensor nodes to support artificial intelligence on the Internet of Things, or “edge AI”.
CEA-Leti today announced during IEDM an extension of its 300mm silicon-based wafer line to open new R&D avenues for its industrial partners.
During the state visit of His Excellency Emmanuel Macron President of the French Republic, the Belgian research center imec and the French research institute CEA-Leti, two world-leading research and innovation hubs in nanotechnologies for industry, announced that they have signed a memorandum of understanding (MoU) that lays the foundation of a strategic partnership in the domains of Artificial Intelligence and quantum computing, two key strategic value chains for European industry, to strengthen European strategic and economic sovereignty.
Tomorrow’s land transportation will be clean, smart, and shared. CEA Tech has been driving advances in the vehicle of the future through targeted research programs for years.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.