Speeding innovation for industry
News | Integrated circuits design
Materials and processes
Electronic component integration densities are constantly increasing, and the pattern resolutions that can be obtained using photolithography are reaching their limits. One alternative method currently being investigated is nanoprinting, which offers the advantage of e-beam lithography’s high resolutions and higher production throughput. “The patterns are created by the mechanical deformation of a resin. A mold, which is similar to a stamp, is used. The process is very simple, which opens the door to higher throughput and lower production costs,” said a Leti researcher.
However, the technique is not suitable for components with high “form ratios” (fine, deep engraved patterns). The researchers replaced the structured resin layer, which usually serves as the mask, with a three-layer stack and modified the lithography and etching process to achieve greater printable form ratios. The initial run of 200 mm wafers completed for an industrial R&D partner is currently undergoing testing. The process could be tested on 300 mm wafers next year.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.