Leti today announced that it has joinedthe GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to supportGLOBALFOUNDRIES’ 22FDX™ technology platform.
Launched this summer, GLOBALFOUNDRIES’ 22FDX technology platform is theindustry’s first 22nm FD-SOI semiconductor technology developed specifically tomeet the ultra-low-power requirements of the next generation of connecteddevices. The versatility of the 22FDX platform is a result of unmatched designflexibility and intelligence, including software-controlled transistor body-biasingthat provides real-time trade-offs between power and performance. DeliveringFinFET-like performance and energy-efficiency at a cost comparable to 28nmplanar technologies, the platform enables a new level of innovations on nextgenerationchips and sets new standards in-terms of user experience for Internetof Things (IoT), mainstream mobile, RF and networking applications.
GLOBALSOLUTIONS was created more than five years ago to spur innovation inthe semiconductor industry and assure chip designers receive world-class servicefrom design conception to production. The eco-system combinesGLOBALSOLUTIONS’ internal resources with a broad spectrum of partners toefficiently enable the fastest time-to-volume for foundry customers.
“Together with our design services partners, we are able to offer a full suite ofservices and comprehensive turnkey solutions that confirms GLOBALFOUNDRIES’leadership in providing high-performance customized products in the FD-SOI andASIC markets,” said Gary Patton, chief technology officer and head of worldwideR&D at GLOBALFOUNDRIES. “Our expanded partnership with Leti further reflectsour commitment to find design implementations that will accelerate time-tovolumeand deliver ultra-low-power solutions to our customers.”
Earlier this year, Leti assigned a team of experts to GLOBALFOUNDRIES’ Dresden,Germany, Fab 1 to support ramp up of the platform. As an ecosystem partner, Letiwill provide GLOBALFOUNDRIES’ customers circuit-design IP, including for its backbiasfeature for FD-SOI, which enables exceptional performance at very lowvoltages with low leakage.
“This strategic partnership with GLOBALFOUNDRIES positions Leti to help a broadrange of designers utilize FD-SOI technology’s significant strengths in ultra-lowpowerand high performance in their IoT and mobile devices with 22nm technology,” said Marie Semeria, Leti CEO. “In addition, it gives both sides’customers increased access to our respective technologies. This kind of partnershipis a key part of Leti’s global strategy.”