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Ion-assisted gate recess process induced damage in GaN channel of AlGaN/GaN Schottky barrier diodes studied by deep level transient spectroscopy

Published on 29 March 2018
Ion-assisted gate recess process induced damage in GaN channel of AlGaN/GaN Schottky barrier diodes studied by deep level transient spectroscopy
Description
 
Date 
Authors
Ferrandis P., Charles M., Baines Y., Buckley J., Garnier G., Gillot C., Reimbold G.
Year2017-0196
Source-TitleJapanese Journal of Applied Physics
Affiliations
Université Grenoble Alpes, Grenoble, France, CEA, LETI, MINATEC Campus, Grenoble, France, Aix-Marseille Université, CNRS, Université de Toulon, IM2NP UMR 7334, La Garde, France
Abstract
Deep traps in AlGaN/GaN Schottky barrier diodes have been investigated using deep level transient spectroscopy. It has been found that ionassisted gate recess process leads to the formation of electron traps. The defects related to these traps are mainly located in the two-dimensional electron gas channel below the Schottky contact, meaning that the partial etching of the AlGaN layer produces damage on the top of the underlying GaN layer. The activation energies of the electron traps, extracted from the data, range between 0.28 and 0.41 eV. We believe that these centers are complexes linked with nitrogen vacancies which may behave as extended defects. © 2017 The Japan Society of Applied Physics.
Author-Keywords
 
Index-Keywords
Activation energy, Deep level transient spectroscopy, Defects, Electron gas, Electron traps, Gallium nitride, Two dimensional electron gas, AlGaN layers, AlGaN/gaN, Deep traps, Extended defect, GaN layers, Gate recess process, Nitrogen vacancies, Schottky contacts, Schottky barrier diodes
ISSN214922
LinkLink

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