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What’s new: CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. The research will focus on assembly of smaller chiplets.,, optimizing interconnection technologies between the different elements of microprocessors, and on new bonding and stacking technologies for3D ICs, especially for making high performance computing (HPC) applications.
Moovlab, a spinoff of CEA-Leti, a CEA Tech institute, helps gyms improve customer loyalty with fun and interactive virtual circuit training tailored to each user’s individual goals.
CEA-Leti, a CEA Tech institute, is gradually shifting over to more sustainable practices.
Virtual Presentation During VLSI 2020 Details Transistors’ Performance And Power-Use Advantages Versus FinFET Devices
CEA-Leti, a CEA Tech institute, unveiled a state-of-the-art demonstrator chip for high-performance computing applications at ISSCC 2020. The low-cost, energy-efficient processor is built on an innovative multi-core system that is both modular and expandable
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.