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Direct Bonding and Debonding Approach of Ultrathin Glass Substrates for High Temperature Devices

Published on 29 March 2018
Direct Bonding and Debonding Approach of Ultrathin Glass Substrates for High Temperature Devices
Description
 
Date 
Authors
Bedjaoui M., Poulet S.
Year2017-0395
Source-TitleProceedings - Electronic Components and Technology Conference
Affiliations
Univ. Grenoble Alpes, Grenoble, France, CEA, LETI, Minatec Campus, Grenoble, France
Abstract
The advent of flexible thin-film electronic devices on ultrathin substrates is driven by the need to develop alternative handling methods fully compatible with front-end and back-end processes. The purpose of this work is to present a new handling approach for ultrathin glass substrates based on direct glass-glass bonding and peel-off debonding at room temperature. This concept is evaluated through the realization of thin-film batteries (500?m) without intermediate layer. The stack of thin film battery is fabricated using sequential physical vapor depositions at temperature values up to 400°C. The debond process is completed at room temperature by mechanical peel-off of the encapsulation film laminated on thin film battery. As the results, there is no sign of any crack of the ultrathin glass (<100µm) after debonding Furthermore, the Electrochemical Impedance Spectroscopy (EIS) and galvanostatic cycling carried out before and after debonding process reveal that the device performances are slightly stable © 2017 IEEE.
Author-Keywords
Bonding process, Debonding technique, Handling, Thin film batteries, Ultrathin glass
Index-Keywords
Debonding, Electric batteries, Electrochemical impedance spectroscopy, Glass, Network components, Secondary batteries, Substrates, Thin films, Bonding process, Galvanostatic cycling, Handling, High temperature device, Intermediate layers, Thin film battery, Ultrathin glass, Ultrathin glass substrates, Glass bonding
ISSN5695503
LinkLink

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