CEA-LETI, Minatec Campus, 17 rue des Martyrs Grenoble, Grenoble Cedex 9, France, EV Group E. Thallner GmbH, DI Erich Thallner Str. 1, St. Florian am Inn, Schärding, Austria

To evaluate the maturity of the wafer-scale NanoImprint lithography (NIL) process, laboratory of electronic and communication technology (LETI) and EV Group (EVG) launched the Imprint Nanopatterning Solution Platform for Industrial Assessment program (INSPIRE), which aims at building a nanoimprint solution platform for industrial assessment and provide a unique open ecosystem for the standardization of the nanoimprint process. This program enabled to gather EVG know-how for the tool manufacturing and its long expertise in bonding activities, and the established methods and advanced microelectronic environment. Presented as an upstream phase, metrology and defectivity were performed on dedicated assessment designs to address critical dimension uniformity (CDU) at wafer scale for a large number of imprints, defectivity on imprints and masters, and alignment capabilities of the nanoimprint HERCULES® platform of EVG. We demonstrate that the critical points are the anti-sticking layer for the defectivity, the CD shrinkage for the CDU, and the stiffness of the soft stamp for the overlay uniformity. Thus, we bring to light the actual capabilities of the HERCULES® platform, and open the discussions on the opportunities for this technology with the possible improvements for the process. © 2017 THOSS Media & De Gruyter, Berlin/Boston.

CDU, defectivity, high-volume manufacturing, nanoimprint, overlay, UV-NIL