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Improvement of Sidewall Roughness of Submicron SOI Waveguides by Hydrogen Plasma and Annealing

Published on 1 October 2018
Improvement of Sidewall Roughness of Submicron SOI Waveguides by Hydrogen Plasma and Annealing
Description
 
Date 
Authors
Bellegarde C., Pargon E., Sciancalepore C., Petit-Etienne C., Hugues V., Robin-Brosse D., Hartmann J.-M., Lyan P.
Year2018-0063
Source-TitleIEEE Photonics Technology Letters
Affiliations
LTM, Centre National de la Recherche Scientifique, University Grenoble Alpes, Grenoble, France, CEA, LETI, LTM, Minatec Campus, Grenoble, France, Commissariat À l'Énergie Atomique et Aux Énergies Alternatives, LETI, Minatec Campus, University Grenoble Alpes, Grenoble, France
Abstract
We report the successful fabrication of low-loss submicrometric silicon-on-insulator strip waveguides for on-chip links. Postlithography treatment and postetching hydrogen annealing have been used to smoothen the waveguide sidewalls, as roughness is the major source of transmission losses. An extremely low silicon line-edge roughness of 0.75 nm is obtained with the optimized process flow. As a result, record-low optical losses of less than 0.5 dB/cm are measured at 1310 nm for strip waveguide dimensions exceeding 500 nm. They range from 1.2 to 0.8 dB/cm for 300-400-nm-wide waveguides. Those results are to our knowledge the best ever published for a 1310-nm wavelength. These results are compared to modeling based on Payne and Lacey equations. © 1989-2012 IEEE.
Author-Keywords
line edge roughness (LER), optical losses, photonic integrated circuits (PICs), Silicon waveguide patterning, smoothing treatments
Index-Keywords
Annealing, Electric losses, Etching, Optical losses, Optical waveguides, Plasma (human), Silicon, Silicon on insulator technology, Waveguides, Line Edge Roughness, Photonic integrated circuits, Propagation loss, Silicon waveguide, smoothing treatments, Roughness measurement
ISSN10411135
LinkLink

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