innovation for industry
The EuroPAT-MASIP project is intended to strengthen the European ecosystem in microelectronics and more specifically in advanced packaging (FOWLP) by developing new technologies and accelerating their transfer to mass volume production. Six separate pilot applications have been allocated to the project consortium members. In particular, they target automotive components such as inertial sensors, tire pressure sensors, image sensors, silicon photo-multipliers, RF transmitters and radar systems.
CEA-Leti's contact :
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.