EVENT
Explore CEA-Leti’s latest results in sustainable IC technologies, co-optimization for advanced 3D and heterogeneous integration and hybrid bonding.
Themed Heterogeneous Integration: Bolstering Europe's Resilience the 3D & Systems Summit 2025 will primarily focus on exploring strategies for enhancing Europe's semiconductor industry addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques. The Summit will feature an exclusive exhibition area, showcasing industry leaders alongside innovative emerging companies. This Summit is a platform for gathering and exchange of knowledge and fostering of collaborations within the semiconductor sector.
THE FAMES PILOT LINE
Don’t miss the FAMES Pilot Line booth, to explore real collaboration opportunities with top European research and industrial partners, and discuss how its state-of-the-art infrastructure can accelerate your innovation.
Featured speakers
DAY 2 | Thursday, June 26
9:25 am - 9:45 am
Sébastien Dauvé
CEO, CEA-Leti
System Technology Co-Optimization for Advanced 3D & Heterogeneous Integration
DAY 2 | Thursday, June 26
11:05 am - 11:50 am
Sébastien Dauvé
CEO, CEA-Leti
Panel Discussion: The Pilot Line’s Role in Bridging the Gap from R&D to Manufacturing
DAY 2 | Thursday, June 26
3:05 pm - 3:10 pm
Sylvie Joly
Partnerships Manager 3D Integration & Packaging, CEA-Leti
Opening Remarks by Session Chair
DAY 2 | Thursday, June 26
3:10 pm - 3:30 pm
Pascal Vivet
Manager of the 3D Heterogeneous Integration Lab, CEA-Leti
Improving Collective and Sequential Processes for Advanced Self-assembly Die-to-Wafer Hybrid Bonding
DAY 2 | Thursday, June 26
3:10 pm - 3:30 pm
Sylvie Joly
Partnerships Manager 3D Integration & Packaging, CEA-Leti
Key Takeaways by Session Chair
DAY 3 | Friday, June 27
Laurent Pain Sustainable Electronics Program Director, CEA-Leti
A Sustainable Integrated Circuit Technologies: a Field of Innovations for the Sake of the Planet