innovation for industry
From 9/18/2019 to 9/20/2019
No. 1, Jingmao 2nd Road, Nangang District, Taipei City, Taïwan 115.
Join CEA-Leti's team to discuss your wafer, high performance computing, edge AI and beyond 5G technology needs.
Discover Leti's Wafer Services:
Discover Leti Silicon Speciality Solutions program also called Leti 3S.
This wafer service enables any industrial partner to validate a proof of concept, a demonstrator in small quantities by implementing the appropriate tools available on CEA-Leti world-class pre-industrial platforms. They've trusted us so far: MIT, CERN and Caltech.
E-Innovation Forum: Special Keynote:
CEA-Leti's CEO, Emmanuel Sabonnadière, will give a special keynote during the E-Innovation Forum on « The new Path for Edge AI », Sept. 18t, 10:15 am, FUTURE Stage, Booth #M1148, 4F, TaiNEX 1. More details here.
Event | Agenda |
The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development results in the field of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano-electronic structures.
Centre des Congrès, Lyon
Are you looking for an R&D partner to bring your project to life or accelerate its market launch?
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.