ECTC has moved to a FREE virtual platform !
Don't miss out CEA-leti's latest scientific results at the Electronic Components and Technology Conference (ECTC). With sessions ranging from future semiconductor packaging, advanced bonding techniques to automotive and power electronics, enjoy the latest R&D available.
Because of COVID-19 concerns and restrictions, the event will be hosted online all month long. Free of charge.
Check out the program on the event website
About CEA-Leti scientific papers @ECTC 2020
Session 1:
- Fan-Out Technologies for System Integration - Committee: Packaging Technologies
- Flexible Fan-Out Wafer Level Packaging of Ultra-Thin Dies - Cea-Leti : Jean-Charles Souriau, Laetitia Castagné, Carine Ladner, Rémi Franiatte, Jennifer Guillaume
Session 2:
- Innovation on WLCSP and 3D Packaging - Committee: Materials & Processing
- Chemical Thinning Approach for High-Topography Glass Wafers: Application for Thin Film Batteries - CEA-Leti : Messaoud Bedjaoui, Jean Brun, Steve Martin, Raphaël Salot
Session 5:
- Advanced Bonding Methods and Processing - Committee: Assembly & Manufacturing Technology
- A Reliable Copper-Free Wafer Level Hybrid Bonding Technology for High-Performance Medical Imaging Sensors - CEA-Leti : Amandine Jouve, Emmanuelle Lagoutte, Romain Crochemore, Gaelle Mauguen, Thierry Flahaut, C. Dubarry, Viorel Balan, Frank Fournel, E. Bourjot, M. Scannell Ams AG : K. Rohracher
Session 31:
- Automotive and Power Electronics Packaging - Committee: Packaging Technologies
- Very Low Parasitic Inductance Double Side Cooling Power Modules Based on Ceramic Substrates and GaN Devices- CEA-Leti : Christine Laurant, Johan Delaine, Pierre Périchon, Charley Lanneluc, Benoit Thollin, René Escoffier, Antoine Izoulet, Manon Porlan, Jean Brun aPSI3D : Jacques Favre