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CEA-Leti@VLSI Symposium

From 6/12/2022 to 6/17/2022
Honululu, Hawaii

​Now in its 42nd year of delivering a unique convergence of technology and circuits for the microelectronics industry, the Symposia on VLSI Technology & Circuits will be merged into one Symposium to maximize the synergy across both domains. The newly merged 2022 IEEE VLSI Symposium on Technology & Circuits is organized around the theme: “Technology & Circuits for the Critical Infrastructure of the Future.” The five-day hybrid event, combining both live sessions onsite at the Hilton Hawaiian Village, as well as on-demand access to selected presentations, is scheduled from June 12 – 17, 2022 in Honolulu, HI. The Symposium will feature advanced VLSI technology developments, innovative circuit design, and the applications they enable, such as artificial intelligence, machine learning, IoT, wearable/implantable biomedical applications, big data, cloud / edge computing, virtual reality (VR) / augmented reality (AR), robotics, and autonomous vehicles.

Intervention of CEA's Experts

Short Course
​Monday, June 13, 10 :30 AM
​“Key low temperature processes for a silicon-based 3D sequential integration”, Xavier Garros
​Invited paper
​Wednesday, June 15, 8:10 AM
​Specificities of linear Si QD arrays integration and characterization, H. Niebojewski, B. Bertrand, E. Nowak, T. Bédécarrats, B. Cardoso Paz, L. Contamin, P.A. Mortemousque, V. Labracherie, L. Brevard, H. Sahin, J. Charbonnier, C. Thomas, M. Assous, M. Cassé, M. Urdampilleta, Y.- M. Niquet, F. Perruchot, F. Gaillard, S. De Franceschi, T. Meunier, M. Vinet
Université Grenoble Alpes and CEA-Leti, CNRS Institut Néel, CEA-Irig

​Wednesday, June 15, - 2:20 PM
​Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver
identification in 500°C devices for 3D sequential integration, T. Frutuoso, X. Garros, P. Batude, B.
Laurent, J. Lacord, B. Sklenard, V. Lapras, C. Fenouillet-Beranger, M. Ribotta , A. Magalhaes-Lucas, J.
Kanyandekwe, R. Kies, G. Romano, E. Catapano, M. Casse, J. Lugo-Alvarez, P. Ferrari, F. Gaillard
CEA- Leti, Minatec Campus, and University Grenoble Alpes, University Grenoble Alpes, Grenoble INP, RFICLab

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