EVENT
Discover CEA-Leti’s latest results in 3D & packaging
CEA-Leti experts will be onsite at CEA-Leti's booth and available to discuss the findings of three papers on heterogeneous integration.
COME AND MEET CEA-LETI'S EXPERTS
This year, CEA-Leti’s booth #28 will exhibit 3D Chiplet integration. Come and discuss lastest achievements in terms of 3D and packaging.
Booth #28
3D Chiplet Integration
Optimizing power, performance, area, cost, and environmental impact with heterogeneous 3D integration
CEA-Leti's 3D integration technologies respond to tomorrow’s challenges in a wide range of applications, including high-performance computing (HPC), AI, co-package optics, RF integration, quantum computing, power delivery, and also imagers and displays.
DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS AT
ESTC
With 3 papers, the institute will present this year’s major scientific results at ESTC, including the following topics:
- TSV
- Heterogeneous integration
- Environmental assessment or FOWLP
| 
|
Wednesday, September 9
3:50 - 4:15 pm
AP 1: Substrate Innovation
David Henry (1),
Aurélia Plihon (1),
Olivier Valorge (1),
Michael Bertucchi (1),
Yohann Rabault (1),
Catherine Brunet-Manquat (1),
Victor Milon (2),
Pascal Chevalier (2),
Baptiste Rault (1)
(1) CEA-Leti, France;
(2) STMicroelectronics, France
Development of Middle Through Silicon Vias (TSV Mid) and Integration in Advanced SiGe BiCMOS Technology for Optical Interconnects
Thursday, September 10
4:35 pm - 5:00 pm
AP 5: Advances in Materials and Processes
Samuel Suhard (1),
Jaber Derakhshandeh (1),
Mélissa Najem (2),
David Henry (2),
Eduardo Coutino (1),
Vasiliki Kosma (1),
Frank Windrich (3),
Anne Jourdain (1),
Eric Beyne (1),
(1) Imec, Belgium;
(2) CEA-Leti France;
(3) Fraunhofer IZM, Germany
Heterogeneous Integration of Die to Wafer Microbumps Bonding and Hybrid Cu Bonding on a Single Interposer
ABOUT
ESTC
The 11th IEEE Electronics System-Integration Technology Conference will be taking place in Helsinki from September 9-11, 2026. IEEE ESTC is the premier international event in the field of electronics packaging and system integration and the IEEE EPS flagship conference in Europe, co-sponsored by IMAPS Europe. This year’s conference is chaired by Toni Mattila from Business Finland.
More information on ESTC’s website