EVENT
Discover CEA’s latest advances in interconnection technologies
The IITC conference invites original research on advanced interconnect, metallization, and 3D heterogeneous integration technologies for ULSI IC applications.
DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS
With 2 papers,the institute will present this year’s major scientific results at IITC26. including the following topics:
papiers scientifiques du CEA-Leti
3 Wenesday June 2026
04:10 PM - 04:30 PM
Paper 10.3
Hayes Mansion
1st Author : Emmanuel Petitprez
Authors: Pierre Brianceau
Alexis Krakovinsky
Krunoslav Romanjek
Yves Maneglia
Olivier Billoint
Jorge Nacenta-Mendivil
Fabien Bringuier
Messaoud Bedjaoui
Valérie Lapras
François Aussenac
Ludovic Couture
Alexandre Magalhaes-Lucas
Gennie Garnier
Blandine Duriez
Marie-Claire Cyrille
Claire Fenouillet-Beranger
Relieving M1 Congestion in 10nm FD-SOI Standard Cells with a Low-Cost MOL Integration
ABOUT International Interconnect Technology Conference
The IITC conference invites original research on advanced interconnect, metallization, and 3D heterogeneous integration technologies for ULSI IC applications.
More information on International Interconnect Technology Conference website