EVENT
CEA Leti to Showcase Integrated Expertise In Microelectronics Reliability at IRPS 2026
At IRPS 2026, the premier forum for new and original research in microelectronics reliability, CEA Leti will present seven papers that reflect a broad and integrated expertise across device physics, process integration, RF technologies, FD SOI, GaN, BEOL reliability, and low temperature platforms enabling 3D sequential integration. Institute research engineers also contributed to two other projects whose work will be presented.
The papers demonstrate the institute’s ability to combine innovative characterization methods with physics based modelling, delivering early stage reliability insights that guide both technology developers and circuit designers toward robust, industrial grade solutions.
“These presentations reflect CEA-Leti’s depth in microelectronic reliability—from low-temperature integration and advanced materials analysis to physics-based modeling and design-level mitigation,” said Olivier Faynot, director of CEA-Leti's Silicon Components Department and IEEE Fellow. “By deepening understanding of key degradation mechanisms and circuit-level constraints, our teams provide practical insight that accelerates the industrial readiness of GaN, FD-SOI, and 3D sequential technologies.”
DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS AT IRPS
Seven Papers Present Early Stage Insights to Guide Technology Developers And Circuit Designers Toward Robust, Industrial Grade Solutions :
- Radio Frequency
- 3D Sequential Integration & Low Temperature Technologies
- FD-SOI
Radio Frequency [Alexis Divay / RF/mmW/5G session]
3D Sequential Integration & Low Temperature Technologies
[FD-SOI]
Wednesday, 25 March 2026
2:00-2:25 PM
7A - Transistors
Grand Ballroom Salon BC
Tadeu MOTA FRUTUOSO
William VANDENDAELE
Jerome MAYOLET
Blend MOHAMAD
Joel KANYANDEKWE
Lucie LARAIGNOU
Melanie DARTOIS
Fabien BRINGUIER
Valerie LAPRAS
Vincent JOUSSEAUME
Chloe GUERIN
Antoine RAISON
Krunoslav ROMANJEK
Zdenek CHALUPA
Marie-Claire CYRILLE
Claire FENOUILLET-BERANGER
Blandine DURIEZ
Xavier GARROS
Spacer trapping effect on hot carriers’ degradation dynamics for advanced FDSOI nodes
ABOUT IRPS
For over 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic systems through an improved understanding of both the physics of failure as well as the application environment.
IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world.
More information on IRPS Website