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Leti Devices Workshop 2022 Speakers

Published on 4 November 2022

Sébastien Dauvé

  • Sebastien Dauvé was named Director of CEA-Leti effective on July 1, 2021, after more than twenty years of experience in microelectrics technologies and their applications, including clean mobility, medicine in the future, cyberecurity, and power electronics. 

  • Sebastien Dauvé started his career at the French Armament Electronics Center, where he worked on developing synthetic-aperture radar. In 2003, he joined CEA-Leti as an industrial transfer manager and supervised several joint research laboratories, in particular with the multinational Michelin.

  • in 2007, Sebastien Dauvé became a laboratory manager, then head of an R&D department in the area of sensors applied to the Internet of things and electric mobility.  During this time, he supported the dissemination of new technologies in industry, including the automotive industry (Renault), aeronautics, national defense (SAFRAN), and microchips with the industry leader Intel. He played an active role in the creation of start-ups in application fields ranging from health to infrastructure security, leading to dozens of new jobs. In 2016, he became Director of the CEA-Leti Systems Division.

  • From sensors to wireless communication, Sebastien Dauvé has played an active role in the digital transformation, focused on coupling energy frugality and performance. He has made cross-disciplinary approaches central to innovation by harnessing the expertise of talented teams with diverse backgrounds. Their goal is to provide technological tools for meeting the major societal challenges of the future.

  • Sebastien Dauvé is a graduate of the prestigious French Ecole Polytechnique and the National Higher French Institute of Aeronautics and Space (ISAE-SUPAERO)


Olivier Faynot 
Head of Silicon Component Division, CEA-Leti

  • Olivier Faynot received the M.Sc and Ph.D. degrees from the Institut National Polytechnique de Grenoble, France in 1991 and 1995, respectively. His doctoral research was related to the characterization and modeling of deep submicron Fully Depleted SOI devices fabricated on ultrathin SIMOX wafers. He joined LETI (CEA-Grenoble, France) in 1995, working on Partially Depleted and Fully Depleted SOI technologies development in the frame of Industrial Partnerships. From 2008 to 2017, he managed various teams focussed on advanced CMOS, memories and 3D technology integration and was assigned on manufacturing sites to implement FDSOI technologies. From 2017 to 2019, he managed the Patterning department at CEA-LETI, within the Silicon Technology division.

  • Since 2020, he is managing the Silicon Component division at CEA-LETI. He is author and co-author of more than 300 scientific publications in journals and international conferences., and was successively in the committees of the main international Semiconductors conferences like International Electron Device Meeting (IEDM), the symposium on VLSI Technology, the IEEE International SOI conference, the EUROSOI network, the Solid State Device and Materials (SSDM) conference and the International S3S conference.


Elisa Vianello 
Embedded AI Program Director, CEA-Leti

  • Elisa is a senior scientist at CEA-Leti. She joined the institute in 2011 after spending one year on the research staff at Fondazione Bruno Kessler, Trento. Her current research interests concern the development of new technologies for bio-inspired neuromorphic computing, with special focus on resistive switching memory devices. She has authored or co-authored 4 book chapters and more than 100 technical papers.

  • She is coordinator of the "MeM-Scales" (2020-2022) European project (H2020) focused on the codevelopment of a novel class of algorithms, devices and circuits that reproduce multi-timescale processing of biological neural systems. In 2022 she won an ERC Consolidator Grant on "Heterogeneous integration of imprecise memory devices to enable learning from a very small volume of noisy data".

  • She is member of the editorial board of the Neuromorphic Computing and Engineering IOP Science journal (2019-now); associate editor of the Special issue on Emerging Materials in Neuromorphic Computing, AIP APL Material (2020); associate editor of the IEEE Trans. on Circuits and Systems –II (2020-2021).

  • She received the PhD in Electrical Engineering from the Università degli Studi di Udine (Italy) and the Grenoble Institute of Technology (INPG, France) in 2010.


Fabien Clermidy
Head of Digital Systems and Integrated Circuits Division, CEA-List

  • Fabien Clermidy is currently heading the digital architecture and IC design division of CEA.

  • His team develops the hardware and software computing strategy for High-Performance Computing, Artificial Intelligence, Cybersecurity and Cyber-Physical-Systems in relation with system developments in automotive, factory of future, avionics or defense and new nanotechnologies such as 3D chip-stacking, embedded Non-Volatile-Memories, photonic and quantum computing.

  • Fabien has been working in CEA since 2000, holding different positions as project leader and manager of the digital design team and the architecture department. Fabien holds a PhD, a thesis supervisor degree and is a CEA research director. He has published more than 100 papers including in the greatest conferences such as ISSCC, VLSI, DAC, DATE or IEDM. He is also author or co-author of 15 patents. Fabien is in the board of directors of the open Hardware Group leveraging on RISC-V open-source initiative.


Didier Belot
System to Technology Transverse Programs Manager, CEA-Leti

  • Dr Didier Belot, after 30 years with STMicroelectronics, has joined CEA-LETI, Grenoble, France, in 2014. He works as European Programs Coordinator in the System Division; he participates to roadmaps orientations and Programs management. He has written for the H2020 CSA NEREID program dedicated to the 2020-2030 European Roadmap, the connectivity chapter. He participates to ECS-SRIA connectivity chapter, and IRDS "Outside System Connectivity" task group. He presently co-chairs the Communication & Connectivity Experts Group of H2020 CSA CORENECT project. His research present interests are the mmW propagation through plastic; RF to Information transceiver design by Mathematics; THz communications; the III-V devices over Silicon for mmW and THz applications; and RF & mmW for Quantum computing. He was member of the French National Scientific Council for Micro and Nanotechnology field from 2012 to 2016, was member of different conferences program committees as RFIC, ESSCIRC, ISSCC, IEDM. He is member of the IEEE-MTT-9 Technology Committee, (mmW & THz Devices to System), and EuMW TPC. He is reviewer for IEEE MTT, and SSC journals, and author or co-author of about 300 publications and 70 patents.


Emmanuel Hardy 
Research Engineer in Edge AI, CEA-Leti

  • ​Emmanuel Hardy is a researcher in the Integrated Circuits for Power Management, Sensors and Actuators Laboratory. He joined CEA-Leti in 2020. His current research interests cover sensor-data processing and circuits for tiny machine learning. He previously worked as an audio mixed-signal electronics and algorithms engineer at Wolfson Microelectronics and Cirrus Logic. He holds a master's degree in microelectronics from the Ecole des Mines de Saint-Etienne and a Ph.D. degree in electrical engineering from Aix-Marseille University.


Thomas Signamarcheix
VP Strategic Development, CEA-Leti

  • Thomas Signamarcheix joined CEA-Leti in 2008, and in 2011, he was named manager of a research laboratory on substrates engineering. From 2015 to 2019, he was in charge of business development management for Leti's Silicon Component Division and Architecture and Embedded Software Division.

  • As Key Account Manager of several strategic collaborations, he also directly managed a wide range of activities (semiconductor, alternative energy, sensor, radio-frequency, etc.) promoting innovation at both hardware and architecture levels. 

  • He has been vice president of CEA-Leti's strategic development since 2020, managing Leti's strategic program (Quantum Electronic, Artificial Intelligence, wearable healthcare devices and mixed reality) and strategic partnerships. He has a PhD in the physics of semiconductor devices from Grenoble Institute of Technology (INPG), and he has contributed to nearly 10 patents and co-authored more than 50 scientific publications.