innovation for industry
From 10/16/2018 to 10/16/2018
San Francisco, USA
Leti, IRT NanoElec and Qualcomm are pleased to invite you to the 3DVLSI open workshop dedicated to High Density 3D-IC and CoolCubeTM (Monolithic/Sequential 3D) technologies. The event is organized as a satellite event of the IEEE 2018 S3S conference and will take place on Tuesday, Oct 16, 2018.
The 3DVLSI open workshop project's goals include building a complete ecosystem that takes the technology from design to fabrication.
A first 3DVLSI open workshop was organized in San Diego back in 2014. Since then, we have seen presentations from Applied Materials, ARM, Atrenta, Cadence, CEA-Leti, GeorgiaTech, Globalfoundries, HPE, Intel, Mentor Graphics, Monolithic3D, Qualcomm, Stanford University, TSMC and many more…
Now, the workshop has become a forum for industrial partners and ecosystem to share research & development progress in making innovative High Density 3D technologies a truly feasible path towards 3DVLSI industrialization for reliable and cost effective products.
3D technologies and applicationsSeverine
Cheramy, CEA-Leti, 3D Business development
3DVLSI CoolCube™ MPW & design roadmapSébastien Thuriès, CEA-Leti, Head of Digital Design
RETINE: A 3D application for parallel Imaging Fabien Clermidy, CEA-Leti, Head of Digital Design
Title to be definedKambiz
Sequential 3D Technology: from more Moore applications to technology diversificationAnne Vandooren, IMEC
Trends in 2.5D/3D High Density Advanced Package Verification Zain Ali, Mentor, A Siemens Business
Low thermal budget technologies for 3D-VLSIPapo Chen, APPLIED MATERIALS
Die-to-Wafer equipment for direct hybrid bonding in productionPascal
Metzger, SET Smart Equipment Technology
Based in the middle of the Alps, CEA's Technological Research Department offers natural responses to the issues and challenges of Alpine stakeholders of tomorrow.
CEA will therefore have a booth dedicated to innovation in Courchevel from February 5-19th
From March 7 to 10, 2023, Global Industrie will once again be the largest French showcase for industrial innovation, with ever more innovations, solutions and, above all, mobilization.
Palais des Congrès du Futuroscope, Poitiers
CNRS and CEA are pleased to invite you to the annual day of the PEPR Electronics, which will be held on Tuesday, March 14, 2023 at the Palais des Congrès du Futuroscope in Poitiers.
Event | Conference |
JW Marriott Orlando Grande Lakes, Florida
Join ECTC, the premier international conference on microelectronic packaging, components, and systems technology from May 30-June 2, in Orlando, Florida.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.