innovation for industry
From 10/16/2018 to 10/16/2018
San Francisco, USA
Leti, IRT NanoElec and Qualcomm are pleased to invite you to the 3DVLSI open workshop dedicated to High Density 3D-IC and CoolCubeTM (Monolithic/Sequential 3D) technologies. The event is organized as a satellite event of the IEEE 2018 S3S conference and will take place on Tuesday, Oct 16, 2018.
The 3DVLSI open workshop project's goals include building a complete ecosystem that takes the technology from design to fabrication.
A first 3DVLSI open workshop was organized in San Diego back in 2014. Since then, we have seen presentations from Applied Materials, ARM, Atrenta, Cadence, CEA-Leti, GeorgiaTech, Globalfoundries, HPE, Intel, Mentor Graphics, Monolithic3D, Qualcomm, Stanford University, TSMC and many more…
Now, the workshop has become a forum for industrial partners and ecosystem to share research & development progress in making innovative High Density 3D technologies a truly feasible path towards 3DVLSI industrialization for reliable and cost effective products.
3D technologies and applicationsSeverine
Cheramy, CEA-Leti, 3D Business development
3DVLSI CoolCube™ MPW & design roadmapSébastien Thuriès, CEA-Leti, Head of Digital Design
RETINE: A 3D application for parallel Imaging Fabien Clermidy, CEA-Leti, Head of Digital Design
Title to be definedKambiz
Sequential 3D Technology: from more Moore applications to technology diversificationAnne Vandooren, IMEC
Trends in 2.5D/3D High Density Advanced Package Verification Zain Ali, Mentor, A Siemens Business
Low thermal budget technologies for 3D-VLSIPapo Chen, APPLIED MATERIALS
Die-to-Wafer equipment for direct hybrid bonding in productionPascal
Metzger, SET Smart Equipment Technology
Hilton San Francisco Union Square
CEA-Leti Will Present Gains in ultimate 3D, RF & Power,Quantum & Neuromorphic Computing with emerging devices
Nikko Hotel, 222 Mason Street, San Francisco, CA 94 702
Efficiency and sustainability are now primary concerns for the production of devices that rely on semiconductors. As a result, research must be organized to find smarter approaches for material integration, device efficiency and long-term sustainability. During the Leti Devices Workshop, CEA-Leti experts will share their visions, innovations and achievements in the field of More than Moore applications.
Notably, the event will highlight key results in terms of efficient computing and radiofrequency devices.
San Francisco, California, United States
EA-Leti's Optics and Photonics multidisciplinary teams will present their latest solutions for all-wavelengths of imaging (visible, infrared, THz). These innovative solutions are ready to be transferred to industry and cover many needs such as information display systems, light-emissive components, optical data communications and optical sensors, among others.
San Francisco, W-Hotel
During the Photonics Workshop, CEA-Leti will unveil new breakthroughs in imaging and next generation displays. We will share and discuss the latest results in integrated photonics technology for communications, computing and sensing.
This workshop offers you a unique opportunity to catch up on the latest cutting-edge research while networking with leading experts and industrial players.
Maison Minatec, Grenoble, France
The world needs lower-power, more resource-efficient electronics for a array of use cases, and the semiconductor industry is understandably excited about the recent surge in investments. This is good news for the industry—and it will create unprecedented opportunities.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.