EVENT
Discover CEA-Leti's latest results in Micro/Nano-Electronics packaging and assembly, design and manufacturing
CEA-Leti experts will be onsite at booth 1 and available to discuss the findings of Six Papers and Posters Includes eco-innovation, microbumps, FO-WLP, packaging and hybrid bonding.
COME AND MEET CEA-LETI'S EXPERTS
This year, CEA-Leti’s booth will exhibit STARAC, Hybrid bonding, Chip-in-Flex, FOWLP. Come and discuss lastest achievements in terms of Next-Generation Chip Integration at MiNaPAD
CEA-Leti’s tech demos - Booth 1
FOWLP
Advanced packaging technology for heterogeneous System-in-Package (SiP)
Quantum packaging
A multi-chip assembly with quantum processor and control chips
STARAC
Chiplet-based Optical Network on Chip (ONoC)
Hybrid bonding
An enabling technology for new architectures
DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS
CEA-Leti will present six papers and posters on technologies shaping the next decade of advanced heterogenous integration at the Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum (MiNaPAD) June 3-4 in Minatec, Grenoble France.
These developments cover a variety of technologies, including :
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eco-innovation,
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microbumps,
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FO-WLP,
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packaging
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hybrid bonding.
CEA-Leti scientific papers
June 3, 2026 - 11:30 am
Session D - Chrome
Margaux VELUIRE
Pressure-less silver sintering for power application: impact of silver, gold or copper surface finishes on microstructure and mechanical performances
June 3, 2026 - 11:30 am
Session Extra - Auditorium
David HENRY
PEPR Packaging (INPACK) and ReNaPack - Projects overview
June 3, 2026 - 12:00 pm
Session C - Auditorium
Mathilde BILLAUD
Learn about 3D integration through its environmental impact
June 4, 2026 - 9:45 am
Session K - Chrome
Jeanny MAURICE
New dielectric materials for low temperature hybrid bonding
June 4, 2026 - 11:45 am
Session M - Chrome
Stelliane GROLIER-LEE
Investigation of wafer level downscaling challenges in electroplated lead-free microbumps for ultra-fine pitch interconnects
June 4, 2026 - 1:45 pm
Session N - Auditorium
Arnaud GARNIER
Radar with Integrated Antennas based on Fan-Out Wafer-Level Packaging RDL-First Integration
ABOUT
MiNaPAD
The Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum (MiNaPAD) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
More information on MiNaPAD’s website