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innovation for industry
Event | Agenda
From 3/15/2026 to 3/19/2026 Los Angeles, California, United States
COME AND MEET CEA-LETI'S EXPERTS AT OFC 2026
Silicon Photonics
Design, process development, testing, and packaging solutions
Silicon PIC Platform
Photonics technologies convergence on silicon CMOS platform
Starac
Chiplet-based Optical Network on Chip (ONoC)
PIC Packaging
High performance packaging towards industrial photonic integrated circuits
Microled for communication
A visible light communication system to improve speed, density and power consumption for high- performance computing
Silicon Quantum photonics
Developing components for quantum communications and computing
DIVE DEEPER INTO PHOTONICS APPLICATION: REGISTER FOR THE LID INTERCONNECT WORKSHOP
The LID Interconnect Workshop will take place in Bervely Hills during OFC 2026.
Discover how CEA-Leti is transforming optical interconnects with cutting-edge technologies designed for datacenters and AI clusters. Join us and meet our experts to learn how these innovations will boost your product development.
ABOUT OFC 2026
The exhibition features more than 700 industry-leading companies representing the entire ecosystem of optical networking and communications. At OFC, attendees have the opportunity to explore groundbreaking technologies, innovative optical networking solutions, specialty fiber products, optical components, devices, systems, test equipment and software. As a global event, OFC provides startups with the opportunity to debut while industry leaders set the pace for the future. It includes unveiling pioneering trends that will define the industry’s trajectory and offer solutions to critical global issues such as quantum networking, artificial intelligence (AI), space optics and data center connectivity.
More information on OFC website
OFC 2026
15-19 March 2026
Los Angeles, California, USA
Top page
Silicon Photonics partnership manager, CEA-Leti
Event | Agenda | Grenoble, France
CEA-Leti is proud to co-organize the first edition of Open Innovation Materials & Manufacturing Europe (OIM² Europe), a new European forum designed to bridge the gap between cutting-edge research and industrial innovation in advanced materials, nanotechnologies, and sustainable manufacturing.
Event | Grenoble Scientific Polygon, France
Europe has the expertise and skills to promote a more responsible digital sector (frugality, regulation, ethics) that creates high-quality jobs. However, mastery of data is just as crucial as mastery of materials and energy when it comes to the operability and sustainability of disruptive digital components and integrated circuits. More sustainable integrated hardware and software solutions will be discussed at the END* symposium in the field of Information & Communication Technologies (ICT)
Event | Agenda | SEMICON Europa, Messe München, Germany.
Artificial intelligence is reshaping the semiconductor landscape, demanding breakthroughs across the entire technology stack. This session explores the deep-tech innovations enabling the AI era—from advanced compute, 3D integration and silicon photonics to power-efficient packaging—before showcasing two real-world demonstrations and concluding with Europe’s vision for sustainable AI infrastructure. During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”. High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.
Event | Agenda | Tokyo, Japan
CEA-Leti has invested in multidisciplinary platforms with unique equipment and expertise. By leveraging advances in heterogeneous integration, new materials and photonics, we are driving semiconductor innovation and tackling the new challenges of disruptive AI markets and technologies. During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”. High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.
Event | Agenda | Interlaken, Switzerland
CEA-Leti has the honour to be invited to organize a Tutorial on sustainability in semiconductor industry and life cycle assement by the Program Chair, Helmut Schift from PSI institute. It will the second edition after the tutorial held in Montpellier in 2024 during the celebration of 50th anniversary. This full-day tutorial objective is to train engineers and young researchers both in assessing the environmental footprint assessing (LCA) and adopting sustainable practices in semiconductor industry based on eco-responsible approach. We will illustrate this using practical case studies, ranging from resource optimisation, greenhouse gas (GHG) emissions or energy consumption reduction to the resilience of electronic components. Lecturers- experts in their field will be speaking : ; Jeff Kettle, University of Glasgow, United Kingdom;Sébastien Toussaint, UCL, Belgium; Cyrille Hibert, EPFL, Switzerland, Isabelle Servin and Yannick Rivoira, CEA-Leti, France
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.