EVENT
Discover CEA-Leti’s latest technological innovations in embedded memory and bonding solutions
CEA-Leti, European major RTO, will be present at Semicon Korea to meet its wide range of partners. Looking for next generation semiconductor and innovative manufacturing process, our team will be delighted to meet and exchange with you throughout the event.
Meet our experts and attend two technical talks
shaping the future of semiconductors.
Session 3: Device technology
Room: 317, Conference Room (South), 3F, COEX
February 11, 02:25 p.m.
Embedded Memory for Future Edge Computing
François Andrieu
CEA fellow & Head of the Laboratory Nano-devices for Memory and Computing, CEA-Leti
Session 6: Advanced Packaging
Room: 317, Conference Room (South), 3F, COEX
February 12, 04:35 p.m.
Plasma-free Hydrophilic Bonding for Wafer to Wafer and Die to Wafer 3D and Photonic Applications
Dr Franck Fournel
CEA Fellow & Head of Bonding Process Engineering, CEA-Leti
ABOUT SEMICON KOREA 2026
SEMICON Korea 2026 will bring together the global semiconductor ecosystem in Seoul, welcoming over 550 companies from around the world across 2,411 booths and nearly 70,000 attendees. Industry leaders will take the stage during keynote sessions, sharing strategic insights on the future of semiconductors. Through 30 technology conferences, more than 200 experts and visionaries will highlight the key trends shaping the industry, from advanced manufacturing to global market dynamics.
More information on SEMICON KOREA WEBSITE