EVENT
Discover CEA-Leti’s latest technological in spie advanced lithography + patterning
With 11 papers,the institute will present this year’s major scientific results at SPIE Advanced Lithography + Patterning search. including the following topics :
Thermal scanning probe lithography into the nanofabrication of semiconductor quantum devices
Evaluation of a non-fluorine (non-PFAS) ArF-immersion photoresist used in semi-conductor manufacturing
Variability aware DUV lithography process optimization for reliability-critical products
Modelling the full process from layout to post-etch imaging using a variational autoencoder
Advanced CDSEM and SEM distortion optimization on thick oxide devices
Characterization of the line edge roughness by small angle X-ray scattering
Exploration and mitigation of local wafer deformations resulting from direct wafer-to-wafer bonding
Cost-effective sub-wavelength structuring via block copolymer blend self-assembly for optical applications
The curvy road to silicon photonics manufacturing
Plasma etching process tailoring for different polysilicon microstructures used in 10 nm FDSOI metal gate stacks.
Sustainable plasma processes for the cleaning of etching reactors
CEA-Leti scientific papers
25 February 2026
4:40 PM - 5:00 PM
Grand Ballroom 220A
Paper 13979-42
1st Author : Emilie Eustache
Authors : Nacenta Jorge
Jonathan Pradelles
Raluca Tiron
SPIE Advenced Lithography + Patterning
Join your community as you meet to hear the latest advances in optical lithography, EUVL, patterning technologies, metrology, and process integration for semiconductor manufacturing and related applications.
More information on SPIE Advenced Lithography + Patterning