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VLSI 2021

From 4/19/2021 to 4/22/2021
Digital/hybrid Event

This international conference, organized by Industrial Technology Research Institute, is focused on the state-of-the-art technology R&D and macro development of semiconductor industry's future and has lasted for more than 30 years with more than 800 attendees annually from around the world. 

We have a guest conference > Joint Session: Design-Technology Co-Optimization and advanced packaging for various applications at circuit and system level

Speaker: Séverine Cheramy. The invited speaker for Joint Special Session-Design-Technology Co-Optimization and Advanced Packaging at 2021 VLSI-TSA.

Invited papers:



​LCMImpact of tunneling layer thickness and remanent polarization on the electrical properties of scalable and BEOL compatible Ferroelectric Tunnel Junctions with large ON/OFF ratio

​J. Barbot et al.

LCTE & LICLRecord RF Performance (ft=180GHz and fmax=240GHz) of a FDSOI NMOS processed within a Low Thermal Budget for 3D Sequential Integration

​T. Mota Frutuoso et al.

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