innovation for industry
Workshop in the frame of the 3DAM European ECSEL Project
CL & TEM Correlation on ingaas samples (8017Ko)
Registration & Information via YURPLAN, registration deadline March 8th Program: Click here
As nano-electronics, technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges which cannot be met by pushing the present techniques to their limits. 3DAM "3D Advanced Metrology and materials for advanced devices" is an EU-funded pathfinding and assessment project focusing on innovations and progress in metrology and characterization related to the latest generation of 3D front-end of line (FEOL) and back-end of line (BEOL) structures (fins, nanowires, TSVs) as well as 2D materials :
• Dimensional metrology: 3D-SPM, CD-SEM, OCD• Structural analysis: Electron Tomography, PL & CL, SHG, GHz-SAM, X-ray NanoCT• Compositional/dopant analysis: SIMS, APT, STEM-EDX and EELS, IRR, Raman, HRXRD• Carrier distribution and mobility: 3D-SSRM, micro-multi-point probes, THz spectroscopy• Strain and stress: HRXRD, Raman, Precession Electron Diffraction in a TEM
The goal of this workshop is to disseminate the results of the projects to the public. The combination with the insights and learnings from experts will make this one-day workshop an up-to-date overview of the most recent advances in the analytical techniques and diagnostic capabilities essential for technology development.
Keynote Speakers:Dr. Maud Vinet (LETI)Prof. Dr. Ehrenfried Zschech (Fraunhofer Institute)Invited Speakers:Dr. Delphine Le Cunff (ST Microelectronics)Dr. Zineb Saghi (LETI)Dr. Igor Turovets (NOVA)
Committee Co-Chairs:Dr. Vincent Delaye (LETI)Dr. Laurens Kwakman (Thermo Fisher Scientific)
Registration & Information via YURPLAN , registration deadline March 8th
San Francisco, CA, USA
Sponsored by IEEE and SSCS, the International Solid-State Circuits Conference – ISSCC – is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip.
San Jose, California, United States
oin SPIE Advanced Lithography + Patterning; the event for emerging technology in the semiconductor industry from 25 - 29 February 2024, in San Jose California, Convention Center. Join Leti and other leading researchers who are solving challenges in optical and EUV lithography, patterning technologies, DTCO and Computational Patterning, metrology, and process integration for semiconductor manufacturing and adjacent applications…
CEA-Leti are involved in 9 proceedings
Hard Rock Hotel, San Diego
■ How photonics technologies are intercepting AI computing architectures needs and their evolution over the next few years
■ System and application visions on optical interconnects for Cloud AI architectures and future AI factories
■ Photonics Interconnects Technologies from foundry, packaging and system end-user perspectives
■ Leverage a Tier-1 event to enhance your networking across the Photonics ecosystems and supply chain
Minatec, 3 Parv. Louis Néel, Grenoble
Maison Minatec, Grenoble, France
The world needs lower-power, more resource-efficient electronics for a array of use cases, and the semiconductor industry is understandably excited about the recent surge in investments. This is good news for the industry—and it will create unprecedented opportunities.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.