Discover CEA-Leti’s latest technological in 3D and Packaging
CEA-Leti experts will be onsite at booth 507 and available to discuss the key findings presented during the conference. This year, the booth will showcase our latest innovations, including STARAC, Hybrid Bonding, Chip-in-Flex, Silicon Photonics, Next-generation hybrid bonding and FOWLP. Stop by to explore our most recent advances in 3D integration and packaging technologies.
CEA-Leti’s tech demos — Booth 507
Starac
Chiplet-based Optical Network on Chip (ONoC)
Next generation hybrid bonding
An enabling technology for new architectures
Chip-In-Flex
First fully flexible label incorporating an RFID chip and sensors
Fan-Out Wafer-Level Packaging
Advanced packaging technology for heterogeneous System-in-Package (SiP)
Silicon Photonics
Design, process development, testing, and packaging solutions
Next generation hybrid bonding
Testing thousands of pic dies in one day
DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS
With 2 papers, the institute will present this year’s major scientific results at ECTC, including the following topics:
- Morphological Microstructure Characterization
- Silicon photonics, 3D and advanced packaging
May 28, 2025 9:30AM
Session 3 - Texas 4-6
CALVO-MUNOZ Maria-Luisa
Morphological Microstructure Characterization and Optimization of Nanocrystalline Copper Deposition for Fine-Pitch Hybrid Bonding Cu/SiO2 at Low Temperature.
May 29, 2025 9:30AM
Session 15 - Texas 4-6
MOURIER Thierry
Functional demonstrator of a 256 channels beam steering device of a lidar for autonomous driving including silicon photonics, 3D and advanced packaging features : TSV and fine pitch flip chip
ABOUT ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
More information on ECTC website