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Event


ECTC

From 5/27/2025 to 5/30/2025
Dallas, USA

​​​​​​​​​​Discover CEA-Leti’s latest technological in 3D and Packaging

CEA-Leti experts will be onsite at booth 507 and available to discuss the key findings presented during the conference. This year, the booth will showcase our latest innovations, including STARAC, Hybrid Bonding, Chip-in-Flex, Silicon Photonics, Next-​generation hybrid bonding and FOWLP. Stop by to explore our most recent advances in 3D integration and packaging technologies.​

CEA-Leti’s tech demos — Booth 507

Starac​

Chiplet-based Optical Network on Chip (ONoC)​​ ​

 
VIGNETTE_Hybrid-Bonding_CEA.jpg

Next generation hybrid bonding​ ​​

An enabling technology for new architectures​ ​

 

Chip-In-Flex

​First fully flexible label incorporating an RFID chip and sensors​

 

​​Fan-Out Wafer-Level Packaging​​​ ​​​

Advanced packaging technology for heterogeneous System-in-Package (SiP)​​​

  
VIGNETTE_Hybrid-Bonding_CEA.jpg

​Silicon Photonics​​​​​​​ ​

Design, process development, testing, and packaging solutions​​​ ​

 
VIGNETTE_Hybrid-Bonding_CEA.jpg

Next generation hybrid bonding​ ​​

Testing thousands of pic dies in one day​ ​

 




DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS 

With 2 papers, the institute will present this year’s major scientific results at ECTC, including the following topics:

  • ​Morphological Microstructure Characterization
  • Silicon photonics, 3D and advanced packaging


May 28, 2025 9:30AM​
Session 3 - ​Texas 4-6

CALVO-MUNOZ Maria-Luisa ​

Morphological Microstructure Characterization and Optimization of Nanocrystalline Copper Deposition for Fine-Pitch Hybrid Bonding Cu/SiO2 at Low Temperature.

May 29, 2025 9:30AM​
Session 15 - Texas 4-6​

MOURIER Thierry 

Functional demonstrator of a 256 channels beam steering device of a lidar for autonomous driving including silicon photonics, 3D and advanced packaging features : TSV and fine pitch flip chip​



ABOUT ECTC

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.​

DL_Icon.pngMore information on ECTC website​


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Practical information

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CEA-Leti contacts

Martin Gallezot

Deputy Head, Silicon Components Division

Stephane Bernabe

Head of the Photonic Packaging Lab​










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