innovation for industry
News | New industrial production processes
CEA-Leti recently completed an equipment collaboration with SET (Smart Equipment Technology) for its direct hybrid bonding die-to-wafer process that combines precise alignment (under 1 micron) and high throughput. In collaboration with Intel, CEA-Leti is also exploring another die-to-wafer process that could multiply current production speeds by four.
The collaboration with SET focused on hybrid bonding between chips and wafers with copper and oxide surfaces. This scenario can be found for example in the case of AI chips that layer III-V materials (LED, image sensors...) on silicon components such as memory and CMOS circuits.
Contact: Emilie Bourjot
Chip Scale Review
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.