March 19th, 2026, in Warsaw, CEA-Leti and the CEZAMAT-WUT (Warsaw University of Technology) reached a major milestone in their collaboration by signing a Memorandum of Understanding (MoU), as part of a joint workshop on FD-SOI technologies and prospects for semiconductors.
The event brought together high-level representatives from academic, industrial, and institutional fields, such as Professor Mariusz Malinowski, Vice-Rector, Scientific Affairs at the Warsaw University of Technology and Jean-René Lèquepeys, Deputy Director and Director of Programs at CEA-Leti. Also present were representatives of the various Polish Ministries and of the French Embassy, and Mr. Dariusz Standerski - Secretary of State at the Ministry of Digital Affairs, and His Excellency, Mr. Étienne de Poncins, Ambassador of France to the Republic of Poland. Their presence was a testament to the strategic importance of this cooperation, which aims to reinforce the technological sovereignty of Europe.
The workshop gave way to discussions on common projects, such as developing FD-SOI technologies and radiation-resistant components. Conversations also showcased the potential of CEZAMAT infrastructures, with 4,000 m² of clean rooms and a European capacity for prototyping components intended for critical spatial, defense, and nuclear sectors.
“Beyond technological stakes, this partnership is founded on a strong belief in collaboration being essential to progress. In a context where challenges such as digital transformation, energy efficiency, advanced computing, or secure electronics are increasingly complex, organizations cannot succeed on their own. It is thanks to strong, trustworthy partnerships such as the one we have created with the CEZAMAT-WUT, that we can truly make a difference," highlighted Jean-René Lèquepeys.
“The bilateral relationship between CEA-Leti and the CEZAMAT-WUT illustrates the value of trustworthy partnerships, able to bring together shared expertise and ambitions," added Professor Mariusz Malinowski.
In concrete terms, the partnership will facilitate sharing knowledge, joint R&D projects, and nurturing talent.
Finally, the collaboration is also part of a wider European effort, alongside projects such as the FAMES pilot line, established as part of the European Chips Act, and strategic discussions about the future of the semiconductor sector, including the RESOLVE initiative, the purpose of which is to put forward paths to pursue to the European Commission (DG CNECT) for the Chips Act 2, currently being discussed at an EU level. CEA-Leti launched the RESOLVE initiative, which now brings together 14 RTOs from 12 European countries, including the Cezamat-WUT for Poland.
This signature therefore marks a tangible step forward toward a more integrated, resilient, and competitive European ecosystem.