You are here : Home > OxRAM memory almost ready to scale up for manufacturing

News

OxRAM memory almost ready to scale up for manufacturing


Rapid advances in resistive oxide memory (OxRAM) could soon put the technology on manufacturers' production lines.

Published on 22 October 2021

​In a recent demonstration by CEA-Leti, 16-kbit arrays were successfully fabricated on 300 mm, 28 nm FDSOI wafers and run for 100,000 cycles with zero memory-point failures.

OxRAM is affordable, high-density, and easy to manufacture. This latest demonstration also proves it is robust and reliable. CEA-Leti introduced a tiny amount of silicon into the active metal (hafnium oxide), an innovation that makes it possible to use a lower voltage, which is easier on the 28 nm transistors closest to the memory.
Several patents were filed as a result of this research and talks are underway with potential manufacturers.

Source : Mina-news



Top page