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OxRAM memory almost ready to scale up for manufacturing


​Rapid advances in resistive oxide memory (OxRAM) could soon put the technology on manufacturers' production lines.

Published on 22 October 2021

​In a recent demonstration by CEA-Leti, 16-kbit arrays were successfully fabricated on 300 mm, 28 nm FDSOI wafers and run for 100,000 cycles with zero memory-point failures.

OxRAM is affordable, high-density, and easy to manufacture. This latest demonstration also proves it is robust and reliable. CEA-Leti introduced a tiny amount of silicon into the active metal (hafnium oxide), an innovation that makes it possible to use a lower voltage, which is easier on the 28 nm transistors closest to the memory.
Several patents were filed as a result of this research and talks are underway with potential manufacturers.

Source : Mina-news



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