Ever-increasing computing power is required by artificial intelligence, in particular to train algorithms. As a result, AI companies increase the number of graphics processing units (GPUs) to train and run their models, to the point of simultaneously using multiple racks, structures that each contain numerous GPUs.
However, this type of configuration requires the capacity to interconnect the GPUs so that high-speed data transmission is ensured. “Traditional copper connections are now at their limit in terms of data rates, reach, bandwidth density and energy efficiency," remarks Yannick Paillard, Chief Commercial Officer at Scintil Photonics.
A complete solution with lasers integrated on a single silicon photonic chip
For more efficient GPU interconnections, the start-up Scintil Photonics enables a different means of data transport with its multi-wavelengths light source. The company, founded in 2018 by Sylvie Menezo, then head of the Integrated Photonics Laboratory at CEA-Leti, specializes in silicon photonics applied to optical connectivity.
More specifically, Scintil Photonics developed SHIP (Scintil Heterogeneous Integrated Photonics) technology, which is the result of research conducted at CEA-Leti. “Integrating different optical functions into a silicon chip is nothing new. What sets us apart is our ability to add lasers into a silicon photonic chip using a technique developed at CEA-Leti," explains Yannick Paillard. “Furthermore, we collaborated with an industrial partner, Tower Semiconductor, to develop a method of producing these chips, that integrates all these photonic elements on a large scale and at a competitive cost."
Therefore, the Scintil Photonics technology enables significantly higher throughput rates per optical fiber. While copper connections are limited to 200 Gb/s, our DWDM light source, built using SHIP technology, enables speeds of up to 800 Gb/s per fiber and beyond.
“CEA is proud to have been behind the creation of Scintil Photonics and delighted to support them in their development of next-generation solutions. The SHIP technology they developed is a major breakthrough for high-speed interconnections in data centers. Their photonic chips with integrated laser sources, which can be mass-produced and significantly reduce energy consumption, are perfectly adapted to the AI requirements of data centers. Our extensive expertise in direct molecular bonding and our 100 mm to 300 mm photonic platforms will allow us to continue to support innovation and technological excellence," adds Eléonore Hardy, Manager of silicon photonics partnerships at CEA-Leti.
Energy consumption reduced by (at least) a factor of 4
To speed up development, Scintil Photonics completed a €50 million funding round in September 2025. The round brought together all the company's existing investors, as well as new partners such as NVIDIA, the global leader in GPUs and a major stakeholder in AI. This sign of interest demonstrates the suitability of the technology for market needs.
The capital increase will be used to support the industrialization and marketing of Scintil Photonics' first product: LEAF Light, which is based on SHIP technology. This is a remote DWDM (Dense Wavelength Division Multiplexing) light source, which means that it can generate 8 or 16 wavelengths, which are “multiplexed", i.e. assembled into a composite signal, before being modulated by the transmitter, “co-packaged" with the GPU.
DWDM approach, which requires precise wavelength spacing, greatly improves the energy efficiency of data transmission, measured in picojoules per bit transmitted. An optical link powered by LEAF Light will display values between 3.5 and 4 pJ/bit, compared to 15 to 17 pJ/bit for traditional optical modules used in data centers. Simulations indicate that this figure could fall below 1 pJ/bit by integrating the DWDM laser source with the co-packaged transmitter. This will be possible using SHIP technology in the future.
The funding round will also enable the company to strengthen its workforce in various areas, including design, quality control and customer support. Recruitment will take place in France and the United States where many of the company's customers are located.