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Liste de actualités du Leti
CEA-Leti has pioneered a novel method for integrating molybdenum disulfide (MoS₂) onto 200 mm silicon wafers using molecular direct bonding. This innovative approach addresses challenges in the integration of 2D materials into standard semiconductor manufacturing processes.
Presentations Include Lab-to-Fab Developments, Intelligent Systems, And Collaborative Innovations Driving More-Sustainable Integrated Circuits
Presentation at Display Week Paves the Way Toward Displays That Show Content and Sense the Environment
Research engineers at CEA-Leti are redefining the future of display technology with next-generation multifunction displays that go far beyond classical displays. These displays are designed to interact with their environment, offering groundbreaking applications across various industries.
CEA-Leti startup iNGage is developing low-cost, high-performance, miniaturized Inertial Measurement Units. The company's innovative approach is the product of fifteen years' research in micro and nanoelectronics.
The development of hybrid bonding is a key factor for the future of the semiconductor industry. PhD student Mohammad Alsukour's research on this topic won the Best Paper award at 3DIC, an IEEE conference devoted to 3D systems integration. The results that he presented show some encouraging advances for the future of bonding technologies.
Clarivate has released its Top 100 Global Innovators 2025, recognizing organizations that demonstrate consistency and influence in innovation. This year, CEA ranks 30th globally, moving up one place from last year’s 31st position.
A key issue for national sovereignty, microfluidic technology now boasts a dedicated subsidiary in the Auvergne-Rhône-Alpes region. The initiative is driven by CEA-Leti and plasturgy company Infiplast, who are pooling their expertise to create a shared platform for the industrial scaling-up of microfluidic chips.
As the demand for smaller, more powerful chips continues to grow, researcher-engineers face new challenges in ensuring high performance and precision. One of the key innovations enabling this evolution is the backside power delivery network, a cutting-edge approach that optimizes space and efficiency by separating power and signal circuits across different layers of transistors.
CEA-Leti startup, nawu diagnostics, is developing a portable, autonomous solution to analyze pathogens in the air expelled by farm animals. The device offers rapid diagnostics of respiratory pathogens so that the appropriate treatment can be identified as quickly as possible, and thus prevent an epidemic.
France 2030 has announced its support for the ImaSpiiR-X consortium, providing €18.2 million in funding over 60 months to move from black-and-white X-ray medical imaging (which displays only tissue density) to full-colour spectral imaging (capable of identifying tissue composition). To achieve this, the consortium will develop next-generation flat-panel detectors that will provide enriched digital radiographic images, along with advanced analysis algorithms.
The project team led by Karine Abadie, a bonding process engineer, and Ivanie Mendes, a lithography process engineer, was recognized with a 'Best Paper Award' at IITC. This international conference is dedicated to interconnects and BEOL¹/MEOL² metallization in microelectronics. In collaboration with industrial partners ASML and EVG, the research team developed an innovative metrology method to better understand the stress induced by the bonding step in silicon wafer and its impact in lithography.
Download the 2025 Scientific Report to explore detailed examples illustrating this approach and discover how CEA-Leti is shaping the future of high-stakes industries.
Organoids-on-chip technology is opening new frontiers in biomedical research, offering more reliable, human-relevant models for drug testing and disease research
Towards energy-saving chips for digital, analog and RF
In July 2024, while finalizing his PhD thesis, Julien Maillard won first prize in the “Best Student Paper” category at the Secrypt conference in Dijon. His scientific paper on hybrid cyber-attacks targeting embedded devices underscores the continued importance of research into data leaks via physical channels.
Famosos: FArm MOnitoring via Real-time SOil Sensing
Using Quobly’s Strategy to Build Qubits With FD-SOI Technology, Readout Architecture ‘Provides a Path to Low Power and Scalable Quantum’ ICs
‘Design Uniquely Integrates Energy Storage and Voltage Conversion, A New Standard in Efficiency and Autonomy for Small Electromechanical Actuators’
Researcher engineers at CEA-Leti have developed an innovative keyword detection circuit designed to operate with ultra-low power consumption. This cutting-edge technology leverages advanced circuit architectures to enhance the efficiency and autonomy of embedded AI systems. By combining frequency-based signal extraction with neural network processing, this system provides high recognition accuracy while consuming significantly less energy and requiring less surface area than existing solutions.
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CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.