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Liste de actualités du Leti
Optically-coupled photonic chips cannot currently be tested at wafer level. Instead, they must be cut, packaged, and then tested individually.
Within CEA Tech and CEA-Leti, activities of the Optics and Photonics division cover most of the largest industrial markets for photonics:
All-wavelength imaging (Gamma and X rays, visible, infrared, THz)
Optical data communications
Optical environmental and 3D sensors
The R&D projects are carried out with both industrial and academic partners. The industrial partners of the Optics and Photonics division range from local SMEs to overseas and global companies.
Our developments merge fundamental physical aspects with advanced technological developments, they interweave nano-sciences, optics, micro-electronics, advanced nano-fabrication, integration and packaging, while taking into account system requirements.
Optics and Photonics division employs 345 persons overall, 235 permanent R&D engineers and technicians, 43 CEA experts and 45 PhD students and post docs. 74 patents filed in 2020 and 700 patents in portfolio
Theoretically, in-memory computing should make it possible to reduce circuit power consumption. Researchers recently verified this hypothesis in the lab, using tools they developed for the programming of innovative computing architectures.
Satellite NB-IoT communications could prove useful wherever terrestrial base stations are lacking, such as in sparsely-populated rural areas and in the oceans, for example.
on the Minatec Campus, the System Division gathers over 300 high level researchers and engineers. This division is at the strategic core of CEA-Leti’s technological innovation and aims to provide a global and valuable “system perspective” on technological trends.
Our’s expertise is based on four major pillars which are (i) wireless communications, (ii) innovative sensor-system design, (iii) power management and electronics for energy and (iv) security solutions for electronic systems and components. Its teams are using tools and know-hows inherited from the physics, electromagnetism and electronic areas as well as from the signal and data processing domains; additionally, they have access to state-of-the-art facilities for the simulation, characterization and prototyping of complex electronic systems.
CEA-Leti has demonstrated record performance in top-tier nMOSFETs using the institute’s 3D low-temperature (LT) sequential integration technology, CoolCubeTM.
CEA-Leti today announced that it has collaborated with Siemens Digital Industries Software to offer an updated process design kit (PDK) that enables photonic designers to select multiple methodologies, including layout centric, schematic driven and layout automation and provides access to CEA-Leti’s 300mm photonics multi-project wafers (MPW).
“Hardware is back” is the theme of the upcoming Leti Innovation Days with STMicroelectronics and Intel Corporation on June 22, 2021. The need to focus on innovations in hardware is more pressing than ever given the exponential increase in the energy consumption of systems expected in the coming years.
CESTI, the IT security testing center at CEA-Leti, has already earned a strong reputation for its expertise in the security of electronic components and devices. It is now the first testing center in France to certify biometric identification solutions. The first-ever certification was granted following an audit completed in partnership with testing lab ELITT.
GRENOBLE, France – May 31, 2021 – Armed with exclusive access to 11 CEA-Leti patents covering specialties such as DNA extraction and microscopic-sample diagnostics, CEA-Leti startup Direct Analysis has developed a pathogenic-bacteria-detection system for food manufacturers that takes one-fourth of the time of existing tests, can minimize stoppage of production lines and reduce food-product recalls and losses.
Low-Cost Gb/s Connectivity Overcomes Limits of Copper Wire and Optical Fiber for Automotive, Aeronautics, Telecom, Industry 4.0 and Healthcare Uses
With the theme “hardware is back”, CEA-Leti will host its annual Leti Innovation Days digitally on June 22 and 23.
A proof-of-concept prototype of a low-cost, compact, wearable tissue oxygenation sensor was developed by CEA-Leti, a CEA Tech institute. A clinical trial demonstrated the device’s effectiveness at monitoring tissue oxygenation.
CEA-Leti today announced the world’s first autonomous imager technology that activates smartphones and small appliances through face recognition or other specific patterns. Called µWAI (micro-WAY) and sized as small as a 1€ coin, the autonomous imager features a novel readout and processing architecture co-designed with an optimized algorithmic pipeline
CEA-Irig was among the partners on a French national research agency (ANR) project that resulted in the on-demand emission of single photons in silicon at 1.28 µm, a wavelength used in telecommunications. They did it by introducing carefully-engineered defects into the material. The goal is to integrate this photon source into CEA-Leti chips for quantum communications.
A silicon qubit tester recently acquired by CEA-Leti will substantially speed up quantum computer research. The tester can measure the electrical performance of several hundred qubits processed on a 300 mm wafer at 1.7 K (-271.3 °C). The qubits that make it through these tests will then be tested individually on a cryostat at Institut Néel at temperatures below 100 mK, a requirement for integration into quantum processors.
2020 will be forever in our memory! And as the world moved on to post-covid-19 era, the semiconductor industry’s response has been watched closely, because its technologies are vital to the success of the global economy and advances across multiple industries. From digital, computing to sensing competitive solutions, CEA-Leti invites decision makers on the lookout for innovative and promising chip-based R&D, as well as editors, analysts and entrepreneurs to peruse the institute’s reader-friendly “2020 Highlights” report:
Optronics researchers love the idea of germanium lasers on silicon—but the devices' contacts are highly thermally unstable. In a world-first, a PhD research project being conducted at CEA-Leti has explained this unpredictable behavior. PhD candidate Andrea Quintero has published ten papers on the phenomenon over the past three years, even winning a Best Paper Award at ECS Prime 2020.
The European DigiFed project, coordinated by CEA-Leti under the IRT Nanoelec technology research organization, brings together sixteen European SMBs around cybersecurity for IoT applications. Specifically, the project partners are investigating the use of STMicroelectronics’ STM32MP1 microprocessor to enhance the security of embedded software.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.