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Liste de actualités du Leti
Soitec and CEA-Leti partner to advance automotive cybersecurity with FD-SOI technology
Youssof Fassi, a PhD student at CEA-Leti, is harnessing artificial intelligence to tackle the challenge of optimizing the reliability of electronic power systems. Linking data and physical models, he is developing hybrid approaches to predictive maintenance that have garnered awards at the APEC and PCIM conferences, the world's flagship power electronics events. His research is paving the way for innovative, non-invasive and resource-efficient solutions allowing real-time monitoring of power converters.
Leveraging its expertise in fields such as integrated circuits for telecommunications, CEA-Leti continues to drive innovation in cutting-edge applications. One of its latest projects is the miniaturization of an Electron Paramagnetic Resonance (EPR) spectrometer, a technology that could redefine how spectrometry is used across various industries.
'Nature Electronics' Paper Details System That Blends Best Traits Of Once-Incompatible Technologies—Ferroelectric Capacitors and Memristors
Last year, the French government tasked the CEA with coordinating an avant-garde research program ("Recherche à Risque” program funded by France 2030 to the tune of €40 million for 2024) in collaboration with all its academic partners. The "Audace!” program aims to stimulate researchers’ creativity by empowering them to boldly explore new avenues and imagine tomorrow’s disruptive innovations. As part of this program led by the Technological Research Department (DRT), CEA-Leti and its partners are tackling one of the major challenges facing digital technology: hardware cybersecurity.
Observing what we cannot see ranks among the great challenges for contemporary science. In the fields of astrophysics and quantum optics, the ability to detect extremely weak signals, in some cases consisting of a single photon, is essential to our efforts to explore the universe or develop new technologies. To meet this challenge, CEA-Leti and partners are taking part in the Audace! program, funded under France 2030’s “recherche à risque” scheme, which supports avant-garde projects imagining the disruptive innovations of tomorrow.
Published in ‘Nature Communications Materials’, Paper Details Creation of Record-Setting Red Emission from InGaN Quantum Wells
The strategy adopted for protecting pancreatic islets from immune rejection is to microencapsulate them in soft, porous, biocompatible microcapsules. CEA-Leti was project coordinator and leader for microcapsule production, characterisation, dissemination and planned usage.
Assessing the thermal conduction at low temperature of materials and technological building blocks is critical to develop cryogenic systems. At CEA-Leti, Charles Bon-Mardion has particularly distinguished himself with the evaluation of the thermal conduction of stacks of superconducting materials. These superconductors will be used to form interconnections aiming to electrically link two chips while thermally isolating them. His research has earned him the Best Paper Award at the IEEE ESTC conference, a landmark event in integration and packaging technologies for electronic systems.
Research engineers at CEA-Leti have developed an innovative superconducting interconnect brick that could enable achieving a higher density of chip-to-chip connections while minimizing the thermal transfer between the chips.
Designing ever smarter, more compact, and more advanced image sensors is a key challenge for the evolution of smartphones, connected objects, and artificial vision uses. It is precisely in the field of 3D integration that Stéphane Nicolas, project leader at CEA-Leti, distinguished himself. His innovative research, which was rewarded with the Outstanding Paper Award at the prestigious ECTC conference, opens new perspectives that will improve the architecture and increase the intelligence of sensors which are at the heart of our daily life.
A recently concluded 42-month EU project, ELENA, announced today the development of the first-ever, European-made lithium niobate on insulator (LNOI) substrates for photonic integrated circuits (PICs)—a breakthrough that establishes a fully European supply chain for thin-film lithium niobate (TFLN) technology.
CEA-Leti and Soitec today announced a strategic partnership to enhance the cybersecurity of integrated circuits (ICs) through the innovative use of fully depleted silicon-on-insulator (FD-SOI) technologies. This collaboration aims to position FD-SOI as a foundational platform for secure electronics by leveraging and extending its inherent resistance to physical attacks.
Applied Materials, Inc. and CEA-Leti today announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the organizations plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centers.
A pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing industry today announced the launch of the GENESIS project. This integrated, large-scale initiative aims to enable Europe’s chip industry to meet its sustainability goals—from materials development to final waste treatment.
The FAMES Pilot Line today announced the official launch of the FAMES Academy, a strategic educational initiative designed to support the EU’s commitment to develop next-generation chips. The academy will be unveiled during CEA-Leti Innovation Days—LID World Summit, June 17-19, beginning with its inaugural workshop on June 18 in Grenoble.
The European Union consortium PREVAIL, created to accelerate the development of next-generation edge-AI technologies, will open its services to external customers in June 2025.
A research team from CEA-Leti and STMicroelectronics has made significant strides in advancing 3D integration technologies by optimizing the deposition of nanocrystalline copper (NC-Cu) for fine-pitch hybrid bonding applications.
CEA-Leti will present its latest research for the first time at the ECTC conference, through a paper concluding its work carried out within the European TINKER project. This EU-funded initiative aims to develop innovative manufacturing technologies for customized sensors, with a focus on autonomous vehicles.
CEA-Leti has pioneered a novel method for integrating molybdenum disulfide (MoS₂) onto 200 mm silicon wafers using molecular direct bonding. This innovative approach addresses challenges in the integration of 2D materials into standard semiconductor manufacturing processes.
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CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.